2021 8th International Conference on Mechanical, Materials and Manufacturing (ICMMM 2021)

Conference / Summit (onsite)
Advanced Manufacturing Materials Science

Address: Washington, Washington, USA
Date: 25 to 27 Sep '21

Visit Event Website


Publication:
Option I: Key Engineering Materials/Materials Science Forum by TTP, which will be submitted for Ei Compendex, Scopus, Inspec (IET), etc. (only for papers related to Material)
Option II: Advances in Science and Technology by TTP, which will be submitted for Inspec (IET), Google Scholar, ProQuest, etc. (only for papers related to Mechanical and Manufacturing)
Option III: Some excellent papers could be recommended to International Journal of Mechanical Engineering and Robotics Research (IJMERR), which will be submitted for Scopus. 


Agenda Overview:
Day 1 September 25, 2021     Conference Check in and Materials Collection
Day 2 September 26, 2021     Keynote Forum & Parallel Sessions & Group Photo
Day 3 September 27, 2021     Tour in Washington         

Contact:
Ms. Weng P. L. Hwang
E-mail: icmmm@zhconf.ac.cn
Tel: +1-661-888-4278(USA); +86-28-83207566(China Branch)

On behalf of the Organizing Committees of 2021 8th International Conference on Mechanical, Materials and Manufacturing (ICMMM 2021), we cordially invite you to participate in this event to be held in Washington, USA from September 25-27, 2021, co-sponsored by Capitol Technology University, USA, with its workshop TMAE 2021. ICMMM aims to provide a platform for scholars, engineers, and scientists to present robust research demonstrating the expanding frontiers in the fields of Mechanical, Materials and Manufacturing. The past seven events were held in Chengdu (China, 2014), Paris (France, 2015), Savannah (USA, 2016), Atlanta (USA, 2017), Orlando (USA, 2018), Boston (USA, 2019), Virtual Conference (2020) successively.

Special gratitude would be extended to all keynotes speakers and TPC members for their technical advices, and to all the scholars and experts in this field for eager supports.

For the 8th conference in Washington, the Organizing Committees expects and firmly believes that attendees from all over the world would be harvested academically and enjoy USA customs and practices.

We invite submissions on a wide range of research topics, spanning both theoretical and systems research. The topics of interest include, but are not limited to:

MATERIAL SCIENCE AND ENGINEERING:
Composites 
Micro / Nano Materials
Steel and Iron 
Ceramic
Metal alloy Materials 
 Polymer Materials
Optical/Electronic/Magnetic Materials 
Materials Physics and Chemistry
Building Materials 
New Energy Materials
Environmental Friendly Materials 
Biomaterials and Chemical Materials
Thin Films 
Earthquake Resistant Structures, Materials and Design
Smart and Intelligent Materials 
Hydrogen and Fuel Cell Science, Engineering & Technology
Surface Engineering/Coatings 
Modeling, Analysis and Simulation of Manufacturing Processes
Materials Forming, Machining 
Welding & Joining
Mechanical Behavior & Fracture 
Material Design of Computer Aided
Tooling Testing and Evaluation of Materials 
Microwave Processing of Materials
Mechanical Dynamics and Its Applications 
Mechanical Reliability Theory and Engineering
Vibration, Noise Analysis and Control 
High-speed/Precision Machining and Inspection Technology
Laser Processing Technology 
Power and Fluid Machinery
Energy Machinery and Equipment

MECHANICAL AND MANUFACTURING ENGINEERING:
 
Aerodynamics 
Mechanical and Materials Engineering
Aerospace Systems and Technology 
Alternative energy
Applied Mechanics and Design 
Automation
Biomechanics 
Composite Materials
Computational Fluid Dynamics 
Computer aided engineering design
Concurrent Engineering 
Condition Monitoring
Design and Manufacturing 
Energy and Thermofluids
Energy conversion system 
Energy Management
Finite element analysis 
Fluid Dynamics
Fuels and Combustion 
Green Manufacturing
Heat and Mass Transfer 
Heat exchangers 
Heat Transfer 
Industrial Engineering
Industrial Tribology 
Instrumentation and Control
Internal Combustion Engines 
Machine Design
Machinery Dynamics 
Manufacturing
Materials Science 
Mechanical Engineering
Micro-Machining 
Micro- and Nano Manufacturing
Micro and Nanomaterials 
Modeling of Processes
Nano-Technology 
Noise and Vibration analysis
Optimization of Systems 
Rapid Prototyping
Refrigeration and air conditioning 
Renewable and Non-Renewable Energies
Renewable energy 
Reverse Engineering
Robotics 
Solid and Fracture Mechanics
Solid Mechanics 
Tribology and Reverse Engineering

On behalf of the Organizing Committees of 2021 8th International Conference on Mechanical, Materials and Manufacturing (ICMMM 2021), we cordially invite you to participate in this event to be held in Washington, USA from September 25-27, 2021, co-sponsored by Capitol Technology University, USA, with its workshop TMAE 2021. ICMMM aims to provide a platform for scholars, engineers, and scientists to present robust research demonstrating the expanding frontiers in the fields of Mechanical, Materials and Manufacturing. The past seven events were held in Chengdu (China, 2014), Paris (France, 2015), Savannah (USA, 2016), Atlanta (USA, 2017), Orlando (USA, 2018), Boston (USA, 2019), Virtual Conference (2020) successively.

Special gratitude would be extended to all keynotes speakers and TPC members for their technical advices, and to all the scholars and experts in this field for eager supports.

For the 8th conference in Washington, the Organizing Committees expects and firmly believes that attendees from all over the world would be harvested academically and enjoy USA customs and practices.

We invite submissions on a wide range of research topics, spanning both theoretical and systems research. The topics of interest include, but are not limited to:

MATERIAL SCIENCE AND ENGINEERING:
Composites 
Micro / Nano Materials
Steel and Iron 
Ceramic
Metal alloy Materials 
 Polymer Materials
Optical/Electronic/Magnetic Materials 
Materials Physics and Chemistry
Building Materials 
New Energy Materials
Environmental Friendly Materials 
Biomaterials and Chemical Materials
Thin Films 
Earthquake Resistant Structures, Materials and Design
Smart and Intelligent Materials 
Hydrogen and Fuel Cell Science, Engineering & Technology
Surface Engineering/Coatings 
Modeling, Analysis and Simulation of Manufacturing Processes
Materials Forming, Machining 
Welding & Joining
Mechanical Behavior & Fracture 
Material Design of Computer Aided
Tooling Testing and Evaluation of Materials 
Microwave Processing of Materials
Mechanical Dynamics and Its Applications 
Mechanical Reliability Theory and Engineering
Vibration, Noise Analysis and Control 
High-speed/Precision Machining and Inspection Technology
Laser Processing Technology 
Power and Fluid Machinery
Energy Machinery and Equipment

MECHANICAL AND MANUFACTURING ENGINEERING:
 
Aerodynamics 
Mechanical and Materials Engineering
Aerospace Systems and Technology 
Alternative energy
Applied Mechanics and Design 
Automation
Biomechanics 
Composite Materials
Computational Fluid Dynamics 
Computer aided engineering design
Concurrent Engineering 
Condition Monitoring
Design and Manufacturing 
Energy and Thermofluids
Energy conversion system 
Energy Management
Finite element analysis 
Fluid Dynamics
Fuels and Combustion 
Green Manufacturing
Heat and Mass Transfer 
Heat exchangers 
Heat Transfer 
Industrial Engineering
Industrial Tribology 
Instrumentation and Control
Internal Combustion Engines 
Machine Design
Machinery Dynamics 
Manufacturing
Materials Science 
Mechanical Engineering
Micro-Machining 
Micro- and Nano Manufacturing
Micro and Nanomaterials 
Modeling of Processes
Nano-Technology 
Noise and Vibration analysis
Optimization of Systems 
Rapid Prototyping
Refrigeration and air conditioning 
Renewable and Non-Renewable Energies
Renewable energy 
Reverse Engineering
Robotics 
Solid and Fracture Mechanics
Solid Mechanics 
Tribology and Reverse Engineering

Prof. Ian McAndrew

Capitol Technology University, USA

Prof. Ramesh Agarwal

Fellow of IEEE, AIAA, ASME, AAAS, APS

IConf

Media Partner

Prof. Ian McAndrew

Capitol Technology University, USA

Prof. Ramesh Agarwal

Fellow of IEEE, AIAA, ASME, AAAS, APS

IConf

Media Partner

Venue

Washington

Organizer

CZES

Venue

Washington

Organizer

CZES

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