2021 the 2nd International Conference on Mechanical, Electronic and Robotics Engineering (MERE 2021)

Conference / Summit (onsite & online)
Robotics & Intelligent Machines Electronics & Electrical

Address: Hong Kong, Hong Kong
Date: 25 to 27 Nov '21

Visit Event Website


Publication: 

All accepted papers of MERE 2021 will be collected into MERE 2021 Conference Proceedings, which is indexed by Ei Compendex, Scopus, etc. 


Conference Schedule: 

November 25th, 2021 | Registration & Conference Kits Collection 

November 26th, 2021 | Opening Remarks & Keynote Speeches (Morning) & Parallel Sessions (Afternoon) 

November 27th, 2021 | Social Program 

  
Contact: 

Allison Fung / Ms. (Conference Secretary) 

Web: http://www.mere.org/ 

Email: mere_contact@robotics.ac.cn 

Tel: +86-010-80699230 | +86-18010579209 

2021 the 2nd International Conference on Mechanical, Electronic and Robotics Engineering (MERE 2021) is a forum for presenting excellent results and new challenges facing the field of Mechanical, Electronic and Robotics Engineering. It brings together experts from industry, governments and academia, experienced in engineering, design and research. MERE 2021 offers a rich program, including keynote talks, regular papers. 

The MERE 2021 is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Mechanical, Electronic and Robotics Engineering. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. 

2021 the 2nd International Conference on Mechanical, Electronic and Robotics Engineering (MERE 2021) is a forum for presenting excellent results and new challenges facing the field of Mechanical, Electronic and Robotics Engineering. It brings together experts from industry, governments and academia, experienced in engineering, design and research. MERE 2021 offers a rich program, including keynote talks, regular papers. 

The MERE 2021 is the premier interdisciplinary platform for the presentation of new advances and research results in the fields of Mechanical, Electronic and Robotics Engineering. The conference will bring together leading academic scientists, researchers and scholars in the domain of interest from around the world. 

Li Qiu

IEEE Fellow

Yaochu Jin

IEEE Fellow

IConf

Media Partner

Li Qiu

IEEE Fellow

Yaochu Jin

IEEE Fellow

IConf

Media Partner

Venue

Hong Kong

Organizer

RIOROB

Venue

Hong Kong

Organizer

RIOROB

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