2021 The 6th International Conference on Manufacturing, Material and Metallurgical Engineering (ICMMME 2021)

Conference / Summit (onsite)
Automotive Engineering Advanced Manufacturing

Address: Osaka, Osaka, Japan
Date: 25 to 28 Mar '21

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Following the successes of previous events, the 6th International Conference on Manufacturing, Material and Metallurgical Engineering, will take place in Osaka, Japan from March 25-28, 2021.

The key goal of the conference is aimed at bringing together academicians, scientists, engineers, and researchers working in various disciplines of these fields to exchange views as well as to share their expertise, experience and research results, and discuss the challenges and future directions in their specialized areas of research in these fields.

ICMMME proceedings of past three years have been successfully online and indexed by EI Compendex and Scopus which makes the proceedings high value to the Audiences.

We look forward to your participation and continued engagement at future ICMMME conferences.

Announcement!

The organizing committee is aware that some participants are now facing travel restrictions and may have to cancel their schedule because of COVID-19. In order to encourage the participation, the conference adopts all available social media methods, such as online/video presentation, etc, except the regular presentation styles (oral & poster).

Meanwhile, considering the safety of all participants, the organizer will provide mask, hand sanitizer, and other measures will be taken during the conference to maintain a safer idea exchange environment.

Publication and Indexing:

Accepted papers will be published into IOP Conference Series: Materials Science and Engineering(ISSN: 1757-899X). Content will be submitted to the indexing. 

Conference Chairs :

Ramesh K. Agarwal, Washington University in St. Louis, USA 

Changduk Kong, Chosun University, South Korea 

Program Chairs :

Tsutomu Yoshida, Takushoku University, Japan 

Seong Soo Choi, SunMoon University, South Korea 

S. Lee, Gyeongsang National University, South Korea

Contact:

Ms. Tina Wong 
icmmme_conf@163.com 
+86 139 8006 2041

Original papers are solicited in subjects including, but not limited to the following:

  • Advanced Manufacturing Technology
  • Manufacturing system and simulation
  • Cellular manufacturing
  • Automation, Control and Information Technology
  • Manufacturing processes and technology
  • Manufacturing Engineering
  • Manufacturing Systems and Equipment
  • Lean and Agile Manufacturing
  • Metallurgical Fundamentals and Techniques
  • Nanotechnology
  • New Materials and Performances
  • Optical Material
  • Polymetric Materials
  • Semiconductors
  • Smart Materials
  • Biomedical Materials
  • Carbon based Materials
  • Composite Materials
  • High Strength Alloys
  • Magnetic Materials
  • Materials Physics
  • Materials Processing and Handling
  • Metal Processing

Original papers are solicited in subjects including, but not limited to the following:

  • Advanced Manufacturing Technology
  • Manufacturing system and simulation
  • Cellular manufacturing
  • Automation, Control and Information Technology
  • Manufacturing processes and technology
  • Manufacturing Engineering
  • Manufacturing Systems and Equipment
  • Lean and Agile Manufacturing
  • Metallurgical Fundamentals and Techniques
  • Nanotechnology
  • New Materials and Performances
  • Optical Material
  • Polymetric Materials
  • Semiconductors
  • Smart Materials
  • Biomedical Materials
  • Carbon based Materials
  • Composite Materials
  • High Strength Alloys
  • Magnetic Materials
  • Materials Physics
  • Materials Processing and Handling
  • Metal Processing

Changduk Kong

Chosun University, South Korea

Ramesh K. Agarwal

Washington University in St. Louis, USA

Seok-Soon Lee

Gyeongsang National University, South Korea

Tsutomu Yoshida

Takushoku University, Japan

IConf

Media Partner

Changduk Kong

Chosun University, South Korea

Ramesh K. Agarwal

Washington University in St. Louis, USA

Seok-Soon Lee

Gyeongsang National University, South Korea

Tsutomu Yoshida

Takushoku University, Japan

IConf

Media Partner

Venue

Osaka

Organizer

czesnd

Venue

Osaka

Organizer

czesnd

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