2021 6th International Conference on Mechanical and Electronics Engineering is to be held in Osaka Convention Center, Osaka, Japan during May 10-12, 2021. It is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Sincerely welcome you join with following three types.
- As Author: submit Full-length Manuscript for review before the submission deadline. After acception, the paper can be published and you will be invited to deliver presentation on ICMEE 2021, orally or poster presentation.DOC TEMPLATE
- As Presenter: deliver a presentation on ICMEE 2021, but the manuscript WILL NOT be published. Abstract is necessary to submit. ABSTRACT TEMPLATE
- As Listener: participate and attend all presentation sessions only, neither making presentation nor having paper published. Please downlaod the form, fill it and feed back to secretary icmee@outlook.com REGISTRATION FROM
Conference Proceedings：
Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc
Conference Chairs :
John Mo, Royal Melbourne Institute of Technology, Australia
Shih-Chieh Lin, National Tsing-Hua University, Taiwan
Program Chairs :
Xingjian Jing, The Hong Kong Polytechnic University, Hong Kong
Yu-Liang Chen, National Defense University, Taiwan
Contact：
Ms. Serene Lo
icmee@outlook.com
+86-028-83208181
