2022 10th International Conference on Nano and Materials Science (ICNMS 2022)

Conference / Summit (onsite)
Materials Science Nanotechnology

Address: Singapore, Singapore
Date: 22 to 24 Jan '22

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Publication: 

The registered and presented papers will be published in Materials Science Forum, (ISSN print 0255-5476 / ISSN web 1662-9752) which will be indexed by Ei Compendex, Scopus etc. For more information about the publication, please visit: https://www.scientific.net/MSF/Details 


Speakers: 

* Prof. Ramesh K. Agarwal(Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE) 

William Palm Professor of Engineering, Washington University in St. Louis, USA 

* Prof. Steven Y. Liang (Fellow of ASME, SME, AET) 

Morris M. Bryan, Jr. Professor in Mechanical Engineering for Advanced Manufacturing Systems, Georgia Institute of Technology, USA 

* Prof. Ramulu Mamidala (Fellow of ASM, ASME, SEM and SME) 

Boeing-Pennell Professor of Engineering, University of Washington, USA 

* Prof. Jing Wang 

Director of RF MEMS Transducers Group, Center for Wireless and Microwave Information Systems (WAMI Center), Department of Electrical Engineering, University of South Florida 

* Prof. Sotirios Grammatikos 

Norwegian University of Science and Technology, Norway 


Contact Us: 

Conference Secretary: Ms. Caroline Zhang 

Email: icnms@saise.org 

Tel.: +1-302-444-8432 (USA) / +86-19915511475 (China) 

2022 10th International Conference on Nano and Materials Science (ICNMS 2022) will be held in Singapore during January 22-24, 2022. The aim of ICNMS is to present the latest research and results of scientists related to Nano and Materials Science topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field.

ICNMS 2022 is co-organized by RF MEMS Transducers Group and Center for Wireless and Microwave Information Systems (WAMI Center) of University of South Florida, USA and the South Asia Institute of Science and Engineering (SAISE). ICNMS 2022 is expected to be more exciting, stimulating & educative. The intention is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students across the globe. The organizing committee of Symposium is pleased to invite prospective authors to submit their original manuscripts for possible presentation at ICNMS.

Topics of interest for submission include, but are not limited to:

(01) Materials behavior
(02) Casting and solidification
(03) Powder metallurgy and ceramic forming
(04) Surface, subsurface, and interface phenomena
(05) Coatings and surface engineering
(06) Composite materials
(07) Materials forming
(08) Machining
(09) Nanomaterials and nanomanufacturing
(10) Biomedical manufacturing
(11) Environmentally sustainable manufacturing processes and systems   | (12) Manufacturing process planning and scheduling
(13) Meso/micro manufacturing equipment and processes
(14) Modeling, analysis, and simulation of manufacturing processes
(15) Computer-aided design, manufacturing, and engineering
(16) Semiconductor materials manufacturing
(17) Laser based manufacturing
(18) Precision molding processes
(19) Joining processes
(20) Rapid manufacturing technologies
(21) Nontraditional manufacturing
(22) Nanofabrication, nanometrology and applications
(23) Metrology and measurement 

2022 10th International Conference on Nano and Materials Science (ICNMS 2022) will be held in Singapore during January 22-24, 2022. The aim of ICNMS is to present the latest research and results of scientists related to Nano and Materials Science topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field.

ICNMS 2022 is co-organized by RF MEMS Transducers Group and Center for Wireless and Microwave Information Systems (WAMI Center) of University of South Florida, USA and the South Asia Institute of Science and Engineering (SAISE). ICNMS 2022 is expected to be more exciting, stimulating & educative. The intention is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students across the globe. The organizing committee of Symposium is pleased to invite prospective authors to submit their original manuscripts for possible presentation at ICNMS.

Topics of interest for submission include, but are not limited to:

(01) Materials behavior
(02) Casting and solidification
(03) Powder metallurgy and ceramic forming
(04) Surface, subsurface, and interface phenomena
(05) Coatings and surface engineering
(06) Composite materials
(07) Materials forming
(08) Machining
(09) Nanomaterials and nanomanufacturing
(10) Biomedical manufacturing
(11) Environmentally sustainable manufacturing processes and systems   | (12) Manufacturing process planning and scheduling
(13) Meso/micro manufacturing equipment and processes
(14) Modeling, analysis, and simulation of manufacturing processes
(15) Computer-aided design, manufacturing, and engineering
(16) Semiconductor materials manufacturing
(17) Laser based manufacturing
(18) Precision molding processes
(19) Joining processes
(20) Rapid manufacturing technologies
(21) Nontraditional manufacturing
(22) Nanofabrication, nanometrology and applications
(23) Metrology and measurement 

Ramesh K. Agarwal

Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE

Steven Y. Liang

Fellow of ASME, SME, AET

IConf

Media Partner

Ramesh K. Agarwal

Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE

Steven Y. Liang

Fellow of ASME, SME, AET

IConf

Media Partner

Venue

Singapore

Venue

Singapore

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