Publication History:
ICBMC 2024 >> Vol. 983-Key Engineering Materials (KEM)-ISBN: 978-3-0364-0616-9 >> Indexed by Scopus
ICBMC 2023 >> Vol. 963-Key Engineering Materials (KEM)-ISBN: 978-3-0364-0434-9 >> Indexed by Scopus
ICBMC 2022 >> Vol. 1067-Materials Science Forum (MSF)-ISBN:978-3-0364-0133-1 >> Indexed by Scopus
ICBMC 2021 >> Vol. 896-Key Engineering Materials(KEM)-ISBN:978-3-0357-1892-8 >> Indexed by Ei Compendex & Scopus
ICBMC 2020 >> Vol. 829-IOP Conference Series: Materials Science and Engineering >> Indexed by Scopus
ICBMC 2019 >> Vol. 972-Materials Science Forum(MSF)-ISBN:978-3-0357-1530-9 >> Indexed by Ei Compendex & Scopus
ICBMC 2018 >> Vol. 371-IOP Conference Series: Materials Science and Engineering >> Indexed by Ei Compendex & Scopus

Conference Committees:
Conference Chair:
Prof. Tan Kiang Hwee (IES/JCI/JSCE Fellow), National University of Singapore, Singapore

Conference Co-Chair:
Prof. Zongjin Li (ACI Fellow), Macau University of Science and Technology, China

Program Chairs:
Prof. Ippei Maruyama, The University of Tokyo, Japan & Nagoya University, Japan
Prof. Wei-Ting Lin, National Ilan University

Program Co-Chairs:
Assoc. Prof. S. Joseph Antony (RSC Fellow), University of Leeds, UK
Assoc. Prof. Eshrar Latif, Cardiff University, UK

Publicity Committees:
Assoc. Prof. Duy Nguyen Phan, Van Lang University, Vietnam
Assist. Prof. Yi Shen, Tongji University, China
Dr. Koorosh Gharehbaghi, RMIT University, Australia

Regional Chairs:
Prof. Bashir M Suleiman, University of Sharjah, UAE
Prof. Ludovic Jason, Université Paris Saclay, France
Prof. Zujian Huang, South China University of Technology, China

Award Chair:
Assoc. Prof. Alcestis Rodi , University of Patra, Greece
Looking forward to the Conference Committees in 2026!

Speakers in 2025:
Prof. Ippei Maruyama, The University of Tokyo, Japan & Nagoya University, Japan
Prof. Nuno Dinis Cortiços, University of Lisbon, Portugal
Prof. Wei-Ting Lin, National Ilan University
Assoc. Prof. Doo-Yeol Yoo, Yonsei University, Korea
For more details, you can visit: https://www.icbmc.org/invited.html
Looking forward to the speakers in 2026!

Submission Method:
1.You can submit your paper via submission system: http://confsys.iconf.org/submission/icbmc2026
2.Or directly send to the conference email box: icbmc@cbees.net

Conference Topics (but not limited to):
Topic 1: Architecture and Urban Planning
Architectural Design and Theories
Advanced Construction Materials
Aesthetics and Landscape
Architectural Design and Its Theory

Topic 2: Materials Science and Engineering
Metallic Alloys, Tool Materials
Superplastic Materials
Ceramics and Glasses
Composites

Topic 3: Civil and Structural Engineering
Bridge Engineering; Building Structure and Bridge Engineering
Building Technology; Cartography and Geographic Information System
Coastal Engineering; Computational Mechanics
Computer Simulation and CAD/CAE; Concrete Structures

Topic 4: Materials Properties, Measuring Methods & Applications
Ductility, Crack Resistance, Fatigue, Creep-resistance
Fracture Mechanics, Mechanical Properties
Electrical Properties, and Magnetic Properties
Corrosion, Erosion, Wear Resistance

Topic 5: Materials Manufacturing and Processing
Casting, Powder Metallurgy
Welding, Sintering, Heat Treatment
Thermo-Chemical Treatment
Thin & Thick Coatings
Please check the following link which you can find more topics: https://www.icbmc.org/cfp.html

Conference Program:
March 3, 2026---Reception & Materials Pick-up (Onsite)
March 4, 2026---Opening Remarks & Keynote Speeches & Invited Speeches & Parallel Sessions
March 5, 2026---Invited Speeches & Oral Sessions
March 6, 2026---Technical Visit (Pending & Extra Registration)

Conference Venue:
Meiji University, Surugadai Campus 
Address：1 Chome-1 Kanda Surugadai, Chiyoda City, Tokyo 101-8301, Japan

Contact Us:
Ms. Cynthia Song
Email: icbmc@cbees.net
Tel: +86-28-87577778(Mainland China) +852-3155-4897(Hong Kong)