The 6th Int'l Conference on Condensed Matter and Materials Physics (CMMP 2019) will be held from August 20-22, 2019 in Xi'an, China. This Conference will cover issues on Condensed Matter and Materials Physics. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods. CMMP 2019 will be an important and reliable platform for inspiring international and interdisciplinary exchange at the forefront of Condensed Matter and Materials Physics. The Conference will bring together academicians, engineers, educators and policy-makers from all over the world, and we hope that you will take this opportunity to join us for academic exchange and visit the city of Xi'an. All the accepted papers will be published by Solid State Phenomena owned by TTP publishing in Switzerland and submitted to Ei Compendex databases for indexing.