The 2021 International Conference on Sensing Technology and Applications（ICSTA 2021）
CONFERENCE INFORMATION:
Website：http://www.staic.org/
Conference Date：April 23-25, 2021
Venue：Chengdu, China
Submission Deadline: April 19, 2021
Indexing：EI/Scopus/SCI
The 2021 International Conference on Sensing Technology and Applications（ICSTA 2021）will be held on April 23 to 25, 2021 in Chengdu China. The meeting focused on the research fields of "Sensing Technology" and "Sensing Applications". The aim is to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology, to explore the development path of ecological civilization construction, and to cope with new opportunities and challenges.
We cordially invite you to submit paper and attend ICSTA 2021. Looking forward to your participation!
Keynote speakers
- Prof. Zhi Gao Wuhan University, China
- Prof. Bingguo Liu University of Science and Technology, China Harbin Institute of Technology, China
- Prof. Qingyang Wei University of Science and Technology, China
- Prof. Yang Chai Hong Kong Polytechnic University，China
- Prof. Xinhua Tang Southeast University, China
- Prof. Zhengying Yang University of Taibei, China
CALL FOR PAPERS
The topics of interest for submission include, but are not limited to:
Sensing Technology and Applications:
1. Sensing Theory and New Approach
2. Biosensors
3. Imaging Sensors
4. Immunosensors
5. Magnetic Sensors
6. Smart Sensors
7. 3D Printed Sensors
8. Mechanical Sensors (inertial, pressure, and tactile)
9. Acoustic, Noise and Vibration Sensors
10. Sensors and Actuators
11. Pressure & Strain Sensors
12. Temperature, Humidity and Gas Sensors
13. Ultrasonic, Acoustic, Magnetic Sensors
14. Wireless Sensors and WSN
15. Physical Sensors
16. Chemical & Bio Sensor System
17. Multi-sensor and Sensor-network Systems
18. Fiber Optic Sensors
19. Nano Sensors
20. Lab-on Chip
21. Sensor Semiconductor Material
22. Polymer Materials for Sensors
23. Manufacturing Process
24. Structural Sensing
25. Visual Sensing
26. Human Activity Monitoring
27. Motion and Location Tracking
28. Health Monitoring and Fault Diagnosis
29. Sensors Signal Processing
30. Sensor Modeling & Characterization
31. Modeling and Simulation of Novel Devices
32. Sensor Network and Application
33. Applications of Sensors (automotive, medical, environmental monitoring, consumer, alarm and security, military, nautical, aeronautical and space sensor systems, robotics, and automation)
2. Biosensors
3. Imaging Sensors
4. Immunosensors
5. Magnetic Sensors
6. Smart Sensors
7. 3D Printed Sensors
8. Mechanical Sensors (inertial, pressure, and tactile)
9. Acoustic, Noise and Vibration Sensors
10. Sensors and Actuators
11. Pressure & Strain Sensors
12. Temperature, Humidity and Gas Sensors
13. Ultrasonic, Acoustic, Magnetic Sensors
14. Wireless Sensors and WSN
15. Physical Sensors
16. Chemical & Bio Sensor System
17. Multi-sensor and Sensor-network Systems
18. Fiber Optic Sensors
19. Nano Sensors
20. Lab-on Chip
21. Sensor Semiconductor Material
22. Polymer Materials for Sensors
23. Manufacturing Process
24. Structural Sensing
25. Visual Sensing
26. Human Activity Monitoring
27. Motion and Location Tracking
28. Health Monitoring and Fault Diagnosis
29. Sensors Signal Processing
30. Sensor Modeling & Characterization
31. Modeling and Simulation of Novel Devices
32. Sensor Network and Application
33. Applications of Sensors (automotive, medical, environmental monitoring, consumer, alarm and security, military, nautical, aeronautical and space sensor systems, robotics, and automation)
Publication:
All accepted full papers will be published in conference proceedings and will be submitted to EI Compendex / Scopus for indexing.
Note: All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.
*paper template（Download）, No less than 4 pages.
*Only English manuscripts will be accepted. If you need translation service, please send the Chinese manuscripts directly to the conference email. (contact_icsta@163.com)
Submission Methods
1.The submitted papers must not be under consideration elsewhere.
2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM
3.Please submit the full paper, if presentation and publication are both needed.
4.Please submit the abstract only, if you just want to make presentations.
5.Should you have any questions, or you need any materials in English, please contact us at contact_icsta@163.com
Registration
For the publication on ICSTA2021 conference proceedings:
Item Registration fee (By RMB) Registration fee (By US Dollar)
Paper Publication+Presentation+Attendance | 3200RMB/per paper (4 -6pages) | 450 USD/per paper (4 -6pages)
Additional Paper Publication | 2900RMB/per paper (4-6 pages) | 430 USD/ per paper (4-6 pages)
Extra Pages (Begin at Page 7) | 300RMB/per extra page | 50 USD/ per extra page
Presentation+Attendance | 1500RMB/per person | 250USD/per person
Attendance Only | 1200RMB/per person | 180 USD / per person
Attendees without Submission (Groups） | 1000RMB/per person（≥ 3 persons） | 150 USD / per person（≥ 3 persons）
Program Schedule
April 23 | 13:00-17:00 | Registration
April 24 | 09:00-12:00 | Speeches of Keynote Speakers
| 12:00-14:00 | Lunch
| 14:00-17:30 | Oral Presentations
| 18:00-19:30 | Banquet
April 25 | 09:00-18:00 | Academic Investigation
April 23 | 13:00-17:00 | Registration
April 24 | 09:00-12:00 | Speeches of Keynote Speakers
| 12:00-14:00 | Lunch
| 14:00-17:30 | Oral Presentations
| 18:00-19:30 | Banquet
April 25 | 09:00-18:00 | Academic Investigation
CONTACT US
Conference Secretary: Lyves
E-mail:contact_icsta@163.com
Tel: +86-18239960890
Wechat: M1_050829
QQ: 1029702920
