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2026 10th International Conference on Big Data and Internet of Things (BDIOT 2026)

23 – 25 Oct 2026·China

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  4. 2026 10th International Conference on Big Data and Internet of Things (BDIOT 2026)
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إنترنت الأشياء والأجهزة الذكيةالبيانات الضخمة والتحليلات والرؤى

2026 10th International Conference on Big Data and Internet of Things (BDIOT 2026)

  • التاريخ

    23 - 25 October 2026

  • الموقع

    Shanghai, China

  • نوع الفعالية

    المؤتمرات والقمم

سجّل للحضور
شعار 2026 10th International Conference on Big Data and Internet of Things (BDIOT 2026)
Publication:
BDIOT2026 conference proceeding, which will be indexed by Ei Compendex and Scopus and submitted to be reviewed by Thomson Reuters Conference Proceedings Citation Index (ISI Web of Science).

Collaborated Special ISSUES:
Accepted and registered papers of BDIOT 2026 are possible to be recommended to issue of Advances in Big Data and Internet of Things with the MDPI Sensors (ISSN 1424-8220).
Impact Factor: 3.4 (2023); 5-Year Impact Factor: 3.7 (2023)
Journal Rank: JCR - Q2 (Chemistry, Analytical) / CiteScore - Q1 (Instrumentation)
Indexed by Scopus, SCIE (Web of Science), PubMed, MEDLINE, PMC, Embase, Ei Compendex, Inspec, Astrophysics Data System, and other databases.   

BDIOT Database:
BDIOT 2025 - Chongqing Technology and Business University, Chongqing | ACM, ISBN: 979-8-4007-2019-2
BDIOT 2024 - North China University of Technology, Beijing, China | ACM, ISBN: 979-8-4007-1752-9
BDIOT 2023 - Chongqing Technology and Business University, Chongqing | ACM, ISBN: 979-8-4007-0801-5
BDIOT 2022 - Online conference | ACM, ISBN: 978-1-4503-9036-1
BDIOT 2021 - Online conference | ACM, ISBN: 978-1-4503-9040-8
BDIOT 2020 - Online conference | ACM, ISBN: 978-1-4503-7550-4
BDIOT 2019 - La Trobe University, Melbourne, Australia | ACM, ISBN: 978-1-4503-7246-6
BDIOT 2018 - North China University of Technology, Beijing, China | ACM, ISBN: 978-1-4503-6519-2
BDIOT 2017 - London, UK | ACM, ISBN: 978-1-4503-5430-1
All papers published on BDIOT conference proceeding have been indexed by Ei Compendex and Scopus successfully.

Submission:
a. Full Paper (Presentation and Publication) 
Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding. 
b. Abstract (Presentation only) 
Accepted abstract will be invited to give the oral presentation at the conference, only full paper will not be published after the conference.
BDIOT2026 now is accepting manuscript submissions.

Please submit your full paper to: 
1. https://confsys.iconf.org/submission/bdiot2026
2. contactbdiot@yeah.net

Call for Paper:
Topics of interest for submission include, but are not limited to:
1. BIG DATA RESEARCH
2. INTERNET OF THINGS (IOT) FUNDAMENTALS & APPLICATIONS
3. BIG DATA FOR MULTI-DISCIPLINE SERVICES
4. EMERGING SERVICES AND ANALYTICS
More topics about BDIOT2026, please click here: http://www.bdiot.org/cfp.html 

Conference Chairs in 2026
Rui Wang, Shanghai University, China
Simon Fong, University of Macau, Macau SAR, China

Committee Co-chairs
Huafeng Qin, Chongqing Technology and Business University, Chongqing, China
Alexandre Lobo, University of Saint Joseph, Macao, SAR China

Conference Schedule
October 23, 2026 : Onsite Sign-in, collecting conference materials 
October 24, 2026 : Opening Remarks & Keynote Speeches+Oral & Poster Sessions
October 25, 2026 : Academic Visit/Lab Tour/Social Networking

Contact us:
Ms. Yvaine Yang
Tel.: +86-13980894300
Email: contactbdiot@yeah.net
Wechat: iconf-cs-2


التسعير والتسجيل

سجّل للحضور

التسعير والتسجيل

سجّل للحضور

ابقَ على تواصل مع الفعالية

تابع الفعالية للاطلاع على التحديثات والإعلانات

زيارة موقع الفعالية

Sponsors & Partners

We're proud to partner with industry leaders supporting this event.

شريك إعلامي

  • IConf logo

    IConf

الموقع وقاعة الفعالية

انضم إلينا في هذا المكان العالمي المصمم لإلهام التواصل المثمر.

الموقع

Shanghai, China

Shanghai, China

التاريخ والوقت

23 - 25 October 2026

المنطقة الزمن��ة

GMT+8 (Shanghai)

احصل على الاتجاهات
SA

تنظيم

South Asia Institute of Science and Engineering

Corporate

مشاركة:

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