Highlight:
1. Has been held successfully for twelve years. IEEE fellows join the conference as keynote speakers. Last year, we invited IEEE Fellow, Prof. Yusuke Yamauchi from The University of Queensland, Australia to join as the keynote speaker of the conference.
2. Prof. Ramesh K. Agarwal from Washington University in St. Louis (United States) has been the conference chair for 12 years.
3. Chemical and material engineering, attracts the entrepreneurs and the institutions, universities to attend the conference;
4. Osaka is convenient and international for visitors. Moreover, Kyoto is nearby the conference venue.
5. Journal-IJCEA publication. https://www.ijcea.org/
6. Japanese Visa Assistance service.
The 13th International Conference on Chemical and Material Engineering will be held in Osaka International Convention Center during November 25-28, 2026. Sponsored by South Asia Institute of Science and Engineering, Washington University in St. Louis, USA; Assisted by Many international institutes.
Publication:
All the registered and presented papers will be published in International Journal of Chemical Engineering and Applications. (ISSN 2010-0221 (Print), DOI: 10.18178/IJCEA). Indexed by Chemical Abstracts Services (CAS), Ulrich's Periodicals Directory, CABI, Electronic Journals Library, Google Scholar, ProQuest, Crossref, EBSCO, CNKI.
Submissions Methods:
Write your paper according to the publication's request and submit the paper at: ICCME@saise.org
OR submitted through http://confsys.iconf.org/submission/iccme2026
Topics of interest include, but are not limited to:
Material Science and Engineering
Materials for Energy Harvesting and Storage
Materials for Data Storage
Materials for Electronic and Optical Applications
Concrete
Masonry Materials
Structural Materials
Building Materials
Biomaterials
Nanomaterials
Polymers
Composites
Synthesis, Properties or Applications of Materials
Heat Treatment Processes
Testing, Evaluation and Characterization of Materials
Geochemistry and Health
Chemical Engineering Fundamentals
Chemical Engineering Educational Challenges and Development
Physical, Theoretical and Computational Chemistry
Chemical Reaction Engineering
Chemical Engineering Equipment Design and Process Design
Catalysis & Reaction
Conference Venue:
Osaka International Convention Center
Conference Schedule: (The actual arrangement shall follow the program)
November 25, 2026-09:00-16:00-Registration, collecting conference materials
November 26-27, 2026-09:00-12:00-Opening Remarks & Keynote Speeches
November 26-27, 2026-13:30-18:00-Parallel Sessions (Oral/Poster Presentations)
November 28, 2026-10:00-16:00-Parallel Sessions / Visit / Tour
Contact:
Ms. Lucia Yang
Email: ICCME@SAISE.ORG
Hotline: +86-15008402564 (China) / +852-36789835 (HK)
WeChat: iconf-mse (Please leave message "ICCME2026")
Conference Venue:
Osaka International Convention Center
Address: 5-3-51 Nakanoshima, Kita-ku, Osaka City, Osaka Prefecture, 530-0005 Japan
1. Has been held successfully for twelve years. IEEE fellows join the conference as keynote speakers. Last year, we invited IEEE Fellow, Prof. Yusuke Yamauchi from The University of Queensland, Australia to join as the keynote speaker of the conference.
2. Prof. Ramesh K. Agarwal from Washington University in St. Louis (United States) has been the conference chair for 12 years.
3. Chemical and material engineering, attracts the entrepreneurs and the institutions, universities to attend the conference;
4. Osaka is convenient and international for visitors. Moreover, Kyoto is nearby the conference venue.
5. Journal-IJCEA publication. https://www.ijcea.org/
6. Japanese Visa Assistance service.
The 13th International Conference on Chemical and Material Engineering will be held in Osaka International Convention Center during November 25-28, 2026. Sponsored by South Asia Institute of Science and Engineering, Washington University in St. Louis, USA; Assisted by Many international institutes.
Publication:
All the registered and presented papers will be published in International Journal of Chemical Engineering and Applications. (ISSN 2010-0221 (Print), DOI: 10.18178/IJCEA). Indexed by Chemical Abstracts Services (CAS), Ulrich's Periodicals Directory, CABI, Electronic Journals Library, Google Scholar, ProQuest, Crossref, EBSCO, CNKI.
Submissions Methods:
Write your paper according to the publication's request and submit the paper at: ICCME@saise.org
OR submitted through http://confsys.iconf.org/submission/iccme2026
Topics of interest include, but are not limited to:
Material Science and Engineering
Materials for Energy Harvesting and Storage
Materials for Data Storage
Materials for Electronic and Optical Applications
Concrete
Masonry Materials
Structural Materials
Building Materials
Biomaterials
Nanomaterials
Polymers
Composites
Synthesis, Properties or Applications of Materials
Heat Treatment Processes
Testing, Evaluation and Characterization of Materials
Geochemistry and Health
Chemical Engineering Fundamentals
Chemical Engineering Educational Challenges and Development
Physical, Theoretical and Computational Chemistry
Chemical Reaction Engineering
Chemical Engineering Equipment Design and Process Design
Catalysis & Reaction
Conference Venue:
Osaka International Convention Center
Conference Schedule: (The actual arrangement shall follow the program)
November 25, 2026-09:00-16:00-Registration, collecting conference materials
November 26-27, 2026-09:00-12:00-Opening Remarks & Keynote Speeches
November 26-27, 2026-13:30-18:00-Parallel Sessions (Oral/Poster Presentations)
November 28, 2026-10:00-16:00-Parallel Sessions / Visit / Tour
Contact:
Ms. Lucia Yang
Email: ICCME@SAISE.ORG
Hotline: +86-15008402564 (China) / +852-36789835 (HK)
WeChat: iconf-mse (Please leave message "ICCME2026")
Conference Venue:
Osaka International Convention Center
Address: 5-3-51 Nakanoshima, Kita-ku, Osaka City, Osaka Prefecture, 530-0005 Japan
