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2026 The 9th International Conference on Machine Learning and Machine Intelligence (MLMI 2026)

17 – 20 Jul 2026·Japan

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2026 The 9th International Conference on Machine Learning and Machine Intelligence (MLMI 2026)

17 Jul 2026

Register to Attend
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VF77.2.
AI, Machine Learning & GenAI

2026 The 9th International Conference on Machine Learning and Machine Intelligence (MLMI 2026)

  • 日期

    17 - 20 July 2026

  • 地点

    Japan

  • 活动类型

    Conferences & Summits

Register to Attend
2026 The 9th International Conference on Machine Learning and Machine Intelligence (MLMI 2026) 徽标
Keynote&Invited Speakers:
Prof. Dapeng Wu (IEEE Fellow), City University of Hong Kong, Hong Kong, China
Prof. Xudong Jiang (IEEE Fellow), Nanyang Technological University, Singapore
Prof. Minghua Chen (IEEE Fellow), The Chinese University of Hong Kong, Shenzhen, China
Prof. Farshid Alizadeh-Shabdiz, Boston University, USA

Publication:
Option 1: 
Submitted papers will be peer reviewed by conference committees, and accepted papers after proper registration and presentation will be published into Lecture Notes in Electrical Engineering (Electronic ISSN: 1876-1119 & Print ISSN: 1876-1100) as a proceedings book volume. The book series will be indexed by EI Compendex, SCOPUS, INSPEC, SCImago and other database.

Option 2: 
All papers will be strictly double blind reviewed by the program committee, and accepted papers after proper registration and presentation will be published in the International Conference Proceedings Series by ACM (ISBN: 979-8-4007-2468-8), which will be archived in the ACM Digital Library, and indexed by Ei Compendex, Scopus, etc.

MLMI 2024 conference proceedings (ISBN: 979-8-4007-1783-3) - ACM Digital Library | Ei Compendex | Scopus
MLMI 2023 conference proceedings (ISBN: 979-8-4007-0945-6) - ACM Digital Library | Ei Compendex | Scopus
MLMI 2022 conference proceedings (ISBN: 978-1-4503-9755-1) - ACM Digital Library | Ei Compendex | Scopus
MLMI 2021 conference proceedings (ISBN: 978-1-4503-8424-7) - ACM Digital Library | Ei Compendex | Scopus
MLMI 2020 conference proceedings (ISBN: 978-1-4503-8834-4) - ACM Digital Library | Ei Compendex | Scopus
MLMI 2019 conference proceedings (ISBN: 978-1-4503-7248-0) - ACM Digital Library | Ei Compendex | Scopus
MLMI 2018 conference proceedings (ISBN: 978-1-4503-6556-7) - ACM Digital Library | Ei Compendex | Scopus

Topics:
Topics of interest for submission include, but are not limited to:
Track 1: Deep Learning and Neural Architectures
Neural Architecture Search
Generative Models
Transfer Learning

Track 2: Reinforcement Learning and Sequential Decision Making
Multi-Agent Reinforcement Learning
Time Series and Sequential Data
Real-Time AI Systems

Track 3: Applied Machine Intelligence
Machine Learning in Healthcare
AI in Robotics
Biometric and Behavioral Analytics

Track 4: Natural Language Processing and Multimodal Learning
Large Language Models
Multilingual and Low-Resource NLP
Cross-Modal Retrieval and Generation

Track 5: Emerging Paradigms and Future Directions
Quantum Machine Learning
Federated and Distributed Learning
AutoML and Meta-Learning

Track 6: Explainable, Ethical, and Human-Centered AI
Explainable AI (XAI)
Ethical AI and Fairness
Privacy-Preserving Machine Learning
For more topics, please visit: http://www.mlmi.net/cfp.html

Submission Guideline
1. English is the official language. Paper should be prepared in English.
2. Abstract submission is for presentation only without publication.
3. Full paper submission is for both presentation and publication. (No less than 10 pages)
4. Submission Methods: 
- By online submission system: http://confsys.iconf.org/submission/mlmi2026
- Or Submit to mlmi_contact@163.com as attachment
For more details, please visit: http://www.mlmi.net/submission.html

Contact Us:
Conference Secretary: Miss Joie Wu
Email: mlmi_contact@163.com
Tel: +86-18302820449
WhatsApp: +853-66494438
Website: http://mlmi.net/

价格与注册

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演讲嘉宾

聆听塑造 AI, Machine Learning & GenAI 的世界级声音。

  • Dapeng Wu

    Dapeng Wu

    IEEE Fellow

  • Xudong Jiang

    Xudong Jiang

    IEEE Fellow

Sponsors & Partners

We're proud to partner with industry leaders supporting this event.

Media Partner

  • IConf logo

    IConf

活动地点与场馆

加入我们,来到这个旨在激发有意义连接的世界级场馆。

地点

Tokyo, Japan

Japan

日期与时间

17 - 20 July 2026

时区

GMT+9 (Tokyo)

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IA

主办方

International Association of Computer Science & Information Technology

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