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2027 11th International Conference on Material Engineering and Manufacturing (ICMEM 2027)

28 – 31 Mar 2027·Japan

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Industry Events

全球最值得信赖的B2B活动发现平台。将行业专业人士与重要的会议、展会和峰会连接起来。

  • Industry Events
  • 新闻
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  • 高级主办方
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  • 成为演讲者
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  • 使用条款
  • 隐私政策

© 2026 Industry Events Worldwide。保留所有权利。

VF106.60.
先进制造与材料

2027 11th International Conference on Material Engineering and Manufacturing (ICMEM 2027)

  • 日期

    28 - 31 March 2027

  • 地点

    Osaka, Japan

  • 活动类型

    会议与峰会

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2027 11th International Conference on Material Engineering and Manufacturing (ICMEM 2027) 徽标
Publication:
Accepted papers will be published in below listed journals of Scientific.Net collection. Indexed by Scopus, Inspec, Google Scholar etc.
Defect and Diffusion Forum (DDF)
Solid State Phenomena (SSP)
Materials Science Forum (MSF)
Key Engineering Materials (KEM)

Past Proceedings
ICMEM 2025: Vol. 1027. Key Engineering Materials-ISBN: 978-3-0364-0948-1-Online Linkage | Indexed by Scopus
ICMEM 2024: Vol. 155. Advances in Science and Technology-ISBN: 978-3-0364-0643-5-Online Linkage | Indexed by Scopus
ICMEM 2023: Vol. 963. Key Engineering Materials-ISBN: 978-3-0364-0434-9-Online Linkage | Indexed by Scopus
ICMEM 2022: Vol. 337. Solid State Phenomena-ISBN: 978-3-0364-1171-2-Online Linkage | Indexed by Scopus 
ICMEM 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus

Topics:
Track 1: Advanced Manufacturing and Production Engineering
Track 2: Smart Manufacturing Systems and Digitalization
Track 3: Automation, Robotics and Control
Track 4: Materials Science and Engineering
Track 5: Nanomaterials, Surface and Functional Materials
Track 6: Emerging Materials and Intelligent Technologies
More info., please focus on: https://www.icmem.org/cfp.html

Submission Method:
1. Please log in the Electronic Submission System to submit your full paper and abstract. 
https://confsys.iconf.org/submission/icmem2027
2. Send the file as attachment to icmem@cbees.net directly.

Conference Schedules:
March 28, 2027--Reception & Conference Materials Collection
March 29, 2027--Opening Remarks, Keynote Speeches and Parallel Sessions
March 30, 2027--Invited Speeches and Parallel Sessions
March 31, 2027--Social Activity

Conference Venue:
Osaka International Convention Center
Address: 5-3-51 Nakanoshima, Kita-ku, Osaka City, 530-0005 Japan

Contact Us:
E-mail: icmem@cbees.net (Main Contact)
Tel.: +852-3155-4897/+86-28-87577778
Wechat: iconf-mse
Linked-in: https://www.linkedin.com/in/cms-conference/

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演讲嘉宾

聆听塑造 先进制造与材料 的世界级声音。

  • Shigeru Nagasawa

    Shigeru Nagasawa

  • Hideaki Tsukamoto

    Hideaki Tsukamoto

Sponsors & Partners

We're proud to partner with industry leaders supporting this event.

媒体合作伙伴

  • IConf logo

    IConf

活动地点与场馆

加入我们,来到这个旨在激发有意义连接的世界级场馆。

地点

Osaka, Japan

Osaka, Japan

日期与时间

28 - 31 March 2027

时区

GMT+9 (Tokyo)

获取路线
C

主办方

CMS

Corporate

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