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2027 The 12th International Conference on Composite Materials and Material Engineering (ICCMME 2027)

8 – 10 Jan 2027·Japan

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Industry Events

全球最值得信赖的B2B活动发现平台。将行业专业人士与重要的会议、展会和峰会连接起来。

  • Industry Events
  • 新闻
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  • 关于我们
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  • 高级主办方
  • Event Pro
  • 成为演讲者
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  • 使用条款
  • 隐私政策

© 2026 Industry Events Worldwide。保留所有权利。

VF106.3.
先进制造与材料纳米技术与智能材料

2027 The 12th International Conference on Composite Materials and Material Engineering (ICCMME 2027)

ICCMME 2027

  • 日期

    8 - 10 January 2027

  • 地点

    Sapporo, Japan

  • 活动类型

    会议与峰会

  • 呈现方式

    混合形式(现场和线上)

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2027 The 12th International Conference on Composite Materials and Material Engineering (ICCMME 2027) 徽标

ICCMME Conference Committees

Conference Committee Chairs

Kazuo Umemura, Tokyo University of Science, Japan

Jong Hak Kim, Yonsei University, South Korea

Xiaohong Zhu, Sichuan University, China

Program Committee Chairs

Jung Tae Park, Yonsei University, South Korea

Teik-Cheng Lim, Singapore University of Social Sciences, Singapore

Seok-Keun Koh, C&G Hitech Co., Ltd, South Korea

Conference Proceedings

The registered and presented papers will be published into Key Engineering Materials (ISSN: 1662-9795) Indexed by Elsevier: SCOPUS.

ICCMME2025 - Scientific Books Collection, Vol. 207 | Scopus

ICCMME2024 - Scientific Books Collection, Vol. 148 | Scopus

ICCMME2023 - Scientific Books Collection, Vol. 88 | Scopus

ICCMME2022 - Materials Science Forum (MSF), Vol. 1060 | Scopus

ICCMME2021 - Key Engineering Materials (KEM), Vol. 889 | Ei Compendex & Scopus

ICCMME2020 - Key Engineering Materials (KEM), Vol. 847 | Ei Compendex & Scopus

ICCMME2019 - Key Engineering Materials (KEM), Vol. 801 | Ei Compendex & Scopus

ICCMME2018 - Materials Science Forum (MSF), Vol. 928 | Ei Compendex & Scopus

ICCMME2017 - (American Institute of Physics) AIP, Vol.1846 | Scopus

ICCMME2016 - Materials Science Forum (MSF), Vol. 860 | Ei Compendex & Scopus

History of ICCMME

ICCMME 2026 | January 28-30 | Tokyo University of Science, Japan

ICCMME 2025 | Yonsei University, Seoul, South Korea

ICCMME 2024 | National University of Singapore, Singapore

ICCMME 2023 | Tokyo University of Science, Japan

ICCMME 2021-2022 | Virtual Conference

ICCMME 2020 | Yonsei University, Seoul, South Korea

ICCMME 2019 | Tokyo University of Science, Japan

ICCMME 2018 | National University of Singapore, Singapore

Submission

1. Submission Method

Online Submission System: https://confsys.iconf.org/submission/iccmme2027

2. Submit Full Paper:

We provide a good opportunity by admiring your updated research knowledge and also by publishing it in the conference proceedings of ICCMME2027, which will be submitted for indexing to Scopus, and others.

3. Submit Abstract:

ICCMME2027 accepts abstract paper, which is only accepted for presenting not for publication.

4. Delegates Online Registration:

Please check the delegates registration fee rate via Registration Webpage: https://iccmme.com/registration.html

Please fill the information and complete the payment via Online Payment System: http://confsys.iconf.org/register/iccmme2027

You need to email Payment Order ID & Payment Email to iccmme@saise.org and wait for the secretary's confirmation.

Confirmed by the conference secretary, then delegates registration succeeds.

Conference Schedule

January 8, 2027: Onsite Sign-In & Kits Collection

January 9, 2027: Opening Remarks & Keynote Speeches, Parallel Sessions

January 10, 2027: Parallel Sessions/Tour(pending)

About Sapporo

Sapporo in January is a beautiful, freezing wonderland ideal for snow activities, winter illuminations, indoor food halls, and onsens. Avoid the city's crowded streets by navigating the vast interconnected underground malls, and spend your days enjoying outdoor snow parks, museums, and nearby mountain resorts.

Contact us

Ms. Silvia Li

Tel: +852-36789835

Email: iccmme@saise.org

价格与注册

参会费

$100-500

USD / 每位参会��

注册参会

价格与注册

参会费

$100-500

USD / 每位参会��

注册参会

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地点

Sapporo, Japan

Sapporo, Japan

日期与时间

8 - 10 January 2027

时区

GMT+9 (Tokyo)

获取路线
SA

主办方

South Asia Institute of Science and Engineering

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