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European Data Center Optical Connectivity Forum 2027

26–27 Apr 2027·Germany

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Industry Events

全球最值得信赖的B2B活动发现平台。将行业专业人士与重要的会议、展会和峰会连接起来。

  • Industry Events
  • 新闻
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© 2026 Industry Events Worldwide。保留所有权利。

VF114.35.
业务运营

European Data Center Optical Connectivity Forum 2027

Join industry leaders and innovators for three days of insights, networking, and breakthrough strategies

  • 日期

    26–27 Apr 2027

  • 地点

    Frankfurt am Main, Germany

  • 活动类型

    会议与峰会

  • 呈现方式

    混合形式(现场和线上)

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European Data Center Optical Connectivity Forum 2027 徽标

European Data Center Optical Connectivity Forum 2027

April 26-27, 2027 | Frankfurt

Summit Background

AI infrastructure is rapidly reshaping data centre network architecture, driving demand for higher bandwidth, greater density, lower power consumption and more scalable connectivity. As AI clusters expand across racks, data halls and multiple facilities, traditional interconnect architectures are being pushed to their limits, accelerating the transition toward 800G, 1.6T, CPO, optical I/O and optical switching.

While many next-generation optical interconnect roadmaps are being driven by global hyperscalers, AI compute platforms and semiconductor companies, their deployment in Europe will depend on regional infrastructure requirements, operator priorities and supply-chain readiness.

The European Data Center Optical Connectivity Forum will connect global technology leaders with European data centre operators, cloud and network infrastructure stakeholders, and Europe’s photonics and manufacturing ecosystem. Discussions will focus on how next-generation optical technologies can move from architecture and product development toward reliable, serviceable and commercially scalable deployment across European AI infrastructure.


Topics

Data Center Optical Connectivity Market and Technology Outlook

AI Workloads Reshape Data Center Optical Connectivity Architecture

800G Optical Connectivity for AI Data Center Deployments

Scaling 800G and 1.6T Optical Transceivers for AI Data Centers

Testing, Qualification and Reliability for 1.6T Optical Interconnects

Optical Circuit Switching for Large-Scale AI Infrastructure

High-Speed Interconnects and Optical Engines for AI Switching Architectures

Co-Packaged Optics for Next-Generation AI Networks

Optical Connectivity for Scale-Across AI Infrastructure

Panel Discussion: Interconnect Options for AI Scale-Up and Scale-Out: What Gets Deployed Where?

Silicon Photonics for AI Data Center Interconnects

REASONS TO ATTEND

  1. Explore CPO & Silicon Photonics — Discover the technologies transforming high-speed interconnects.

  2. Solve Power & Density Challenges — Learn how to address bandwidth, power, thermal and reliability demands.

  3. Connect With Industry Leaders — Meet hyperscalers, data centers, optical, semiconductor and networking experts.

  4. Turn Technology Into Deployment — Gain practical insights into scaling next-generation optical connectivity.

  5. Master the 800G → 1.6T Transition — Explore the next generation of AI optical connectivity.

  6. Decode AI Connectivity Trends — Understand how AI workloads are reshaping data center networks.

Contact us:britney@ecvinternational.com
Official website:https://www.ecv-events.com/DCOC2027?cci=35

核心主题:

  • •Data Center Optical Connectivity Market and Technology Outlook
  • •Closing Panel: What Must Be Solved Before Next-Generation Optics Are Ready for AI-Scale Deployment?
  • •Switch Silicon, SerDes and Optical Engine Integration for Next-Generation AI Networks
  • •AI Infrastructure at Scale: Network Architecture and Optical Connectivity Requirements
  • •High-Speed Interconnects and Optical Engines for AI Switching Architectures

价格与注册

参会费

€1000-2500

EUR / 每位参会��

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价格与注册

参会费

€1000-2500

EUR / 每位参会��

立即注册

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活动地点与场馆

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地点

Frankfurt am Main, Germany

日期与时间

26–27 Apr 2027

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ECV International 徽标

主办方

ECV International

Event Management Agency

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