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Southeast Asia Data Center Cooling & Thermal Management Summit 2027

15 – 16 Mar 2027·Singapore

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Industry Events

全球最值得信赖的B2B活动发现平台。将行业专业人士与重要的会议、展会和峰会连接起来。

  • Industry Events
  • 新闻
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© 2026 Industry Events Worldwide。保留所有权利。

VF105.6.
云与边缘基础设施计算设备与操作系统

Southeast Asia Data Center Cooling & Thermal Management Summit 2027

Southeast Asia's AI-ready data center cooling summit. Singapore, 15–16 March 2027. Meet operators, cloud, AI and cooling leaders.

  • 日期

    15 - 16 March 2027

  • 地点

    Singapore, Singapore

  • 活动类型

    会议与峰会

  • 呈现方式

    现场

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Southeast Asia Data Center Cooling & Thermal Management Summit 2027 徽标

The Southeast Asia Data Center Cooling & Thermal Management Summit 2027 will take place in Singapore on March 15 - 16, 2027. The event will bring together data center owners, operators, developers, investors, cloud and AI infrastructure companies, engineering partners, and cooling technology providers.

 

The Summit will provide a platform to discuss market developments, high-density cooling, liquid cooling, energy and water efficiency, system design, project delivery, commissioning, and long-term operations. Participants will have the opportunity to exchange practical experience and explore solutions for the development of reliable and efficient data centers in Southeast Asia.

 

Why Attend:

1, Understand how AI demand is reshaping data center development, market roles, and infrastructure priorities across Southeast Asia.

2, Explore practical strategies for cooling 100kW+ racks in tropical environments.

3, Compare air, hybrid, and liquid cooling architectures for high-density AI and GPU workloads.

4, Learn how to balance PUE, WUE, energy, water, carbon, and reliability targets.

5, Hear real-world insights on system design, redundancy, commissioning, retrofits, and long-term operations.

6, Meet the decision-makers, engineers, and technology partners shaping Southeast Asia’s AI-ready data center capacity.

 

Key Topics on the Agenda:

 

AI & High-Density Infrastructure

·The Thermal Management Challenges of 100 kW+ Racks

·Unlocking More AI Capacity from Every Megawatt Through Cooling Efficiency

·System Design for Mixed Rack Densities from 20 kW to 100 kW+

·Next-Generation AI Processor Cooling: From Chip to Rack

 

Sustainable Cooling in Tropical Markets

·Year-Round Cooling Efficiency and Operational PUE

·Low-Water Cooling & WUE Management

·Balancing Energy, Water & Carbon Targets

·Water Quality Management and Cooling Reliability

 

Liquid Cooling & Thermal Innovation

·Air, Hybrid or Liquid Cooling?

·Intelligent Thermal Management & Dynamic Controls

·Liquid Cooling Operations and Long-Term Reliability

·Scaling Liquid Cooling Beyond Pilot Deployments

 

Design, Delivery & Operations

·Global Standards, Modular Design & Southeast Asian Supply Chains

·Commissioning and Acceptance Testing for High-Density Cooling

·CFD & Digital Twins for Cooling Design and Retrofits

·Cooling Retrofit Pathways for AI & GPU Clusters

 

The Summit will also explore how AI demand is reshaping data center development, site selection, power availability, cooling infrastructure, sustainability requirements and investment decisions across Southeast Asia.

 

Who Should Attend:

Data Center Operators | Developers | Hyperscalers | AI Infrastructure | Cloud Providers | Cooling & HVAC | Engineering & Design | Construction | Facilities | Sustainability | Energy & Water | Chip & Server Manufacturers | Investors

 

With discussions spanning strategy, engineering, technology selection and operational performance, the event offers a focused platform to exchange practical experience, benchmark solutions and explore partnerships for the next phase of Southeast Asia’s data center growth.

 

Join us and help shape the future of AI-ready data center cooling in Southeast Asia.

价格与注册

参会费

$1000-2500

USD / 每位参会��

注册参会

价格与注册

参会费

$1000-2500

USD / 每位参会��

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加入我们,来到这个旨在激发有意义连接的世界级场馆。

Singapore

地点

Singapore

Singapore, Singapore

日期与时间

15 - 16 March 2027

09:00 – 17:00

时区

UTC+08:00 (CST - China, Singapore)

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ECV International 徽标

主办方

ECV International

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