The Next-Gen IC Expo, one of the flagship specialized exhibitions of the 26th China International Industry Fair (CIIF), will take place in Shanghai, China, bringing together leading semiconductor companies, technology innovators, equipment suppliers, and industrial end users. Key highlights include:
Five-Zone Semiconductor Ecosystem
End-to-End Industry Value Chain
Application-Driven Innovation
High-Level Summit & 10+ Technical Forums
Five Dedicated Exhibition Zones
Integrated Circuit Design Zone
EDA Tools & Platforms
IP Cores & IC Design Services
Core Chips & Solutions (Processors, High-Performance Computing (HPC) Chips, Memory Chips, Power Management ICs (PMICs), Power Semiconductors, Modules, etc.)
Other IC Design Services
Wafer Fabrication Zone
Logic & Specialty Process Technologies
IDM & Memory Manufacturing
Compound Semiconductor Manufacturing
Fab Facilities & Smart Manufacturing Solutions
Packaging & Testing Zone
Advanced Packaging Technologies (Wafer-Level Packaging (WLP), System-in-Package (SiP), etc.)
Specialized Packaging Technologies (Automotive Electronics Packaging, MEMS Packaging, IGBT Module Packaging, etc.)
High-Performance Chip Inspection & Analysis
Next-Generation Packaging Technologies (Glass Substrates, etc.)
Semiconductor Equipment & Materials Zone
Wafer Fabrication Equipment (Lithography, Etching, Thin Film Deposition, Cleaning, CMP, etc.)
Metrology, Inspection & Process Control Equipment
Equipment for Compound Semiconductor Manufacturing (Including Epitaxy Systems)
Semiconductor Materials (Silicon Wafers, Substrates, Photoresists, Electronic Specialty Gases, etc.)
Key Subsystems & Core Components (Vacuum Systems, RF Power Supplies, Precision Components, etc.)
Application & System Integration Zone
Industrial Applications
AI Infrastructure
Embodied AI / Embodied Intelligence
Intelligent Vehicles (Automotive Industry Ecosystem)
Consumer Applications
Smart Living (Smart Home Appliances, Wearable Electronics, etc.)
Frontier Technologies
Rather than presenting products by category alone, the exhibition is organized around real industrial applications, showcasing technologies selected for industrial-grade reliability, automotive-grade compliance, and mass-production readiness.
Industry Summit & Technical Forums
Alongside the exhibition, Next-Gen IC Expo will host a three-tier conference program comprising a flagship industry summit, 10+ specialized forums, and exclusive executive networking events.
Bringing together
Government officials
Industry leaders
Technology experts
Investors
The program will explore the latest policy developments, technology trends, and market opportunities, with dedicated sessions on
Automotive semiconductors
Advanced memory
Embodied AI
Industrial robotics
Other emerging topics
