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The 12th International Conference on Mechanical Structures and Smart Materials

25–27 Apr 2027·China

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Manufactura y materiales avanzados

The 12th International Conference on Mechanical Structures and Smart Materials

Shaping the Future with Smart Materials and Advanced Mechanical Engineering

  • Fecha

    25–27 Apr 2027

  • Ubicación

    Shanghai, China

  • Tipo de evento

    Conferencias y cumbres

  • Formato de entrega

    Híbrido (presencial y en línea)

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Logo The 12th International Conference on Mechanical Structures and Smart Materials

The 12th International Conference on Mechanical Structures and Smart Materials (ICMSSM 2027) will be held in Sanya, China, from April 25 to 27, 2027. Since its establishment in 2013, ICMSSM has provided a platform for researchers, engineers, and industry professionals to exchange ideas and share recent developments in mechanical structures and smart materials.

 ICMSSM 2027 will focus on the design, modeling, manufacturing, characterization, and application of mechanical structures and smart materials. Topics include smart and adaptive structures, functional materials and surfaces, advanced manufacturing, automation and robotics, computational modeling, artificial intelligence, structural monitoring, vibration control, and energy harvesting. The program will feature keynote and invited speeches, oral and poster presentations, and technical discussions. We warmly welcome researchers and practitioners worldwide to join us in Sanya.

Temas clave:

  • •Smart Materials and Structures
  • •Mechanical Engineering and Structures
  • •Materials Science and Engineering
  • •Manufacturing Technology and Production Management
  • •Research Methodology, Analysis, and Modeling

Objetivos de aprendizaje

Papers submitted to ICMSSM 2027 will undergo a rigorous peer-review process conducted by the conference committees. Accepted and presented papers will be included in the ICMSSM 2027 Conference Proceedings, which will be published in the IOP Conference Series: Journal of Physics: Conference Series (JPCS) (ISSN: 1742-6596). Furthermore, the proceedings will be submitted for inclusion in major databases such as EI Compendex and Scopus.

Precios e inscripción

Costo de asistencia

$100-500

USD por asistente

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Precios e inscripción

Costo de asistencia

$100-500

USD por asistente

Registrarse ahora

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Ubicación y sede del evento

Únase a nosotros en esta sede de primer nivel diseñada para inspirar conexiones significativas.

Sanya,Hainan

Ubicación

sanya,hainan

Shanghai, China

Fecha y hora

25–27 Apr 2027

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Logo ICMSSM2027

Organizado por

ICMSSM2027

Corporate (Internal Event Organiser)

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