2020 4th International Conference on Measurement Instrumentation and Electronics (ICMIE 2020)

Conference / Summit (onsite)
Engineering Science

Address: Chengdu, Chengdu, China
Date: 18 to 20 Sep '20

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2020 4th International Conference on Measurement Instrumentation and Electronics will be held in  Chengdu, China during September 18-20, 2020.

It has the goal to be an annual conference for researchers, academicians and industry persons in the field of Measurement Instrumentation and Electronics. We hope that this conference will attract a large number of delegates from all over the world and will consist of very high quality technical sessions.

A measuring instrument is a device for measuring a physical quantity. In the physical sciences, quality assurance, and engineering, measurement is the activity of obtaining and comparing physical quantities of real-world objects and events.

Important Message | 通知


As the coronavirus (COVID-19) spreads worldwide, ICMIE is keep following and monitoring carefully and continuously the World Health Organization’s situation updates regarding the COVID-19 pandemics. ICMIE will follow the guidelines of WHO and local government agencies on the current situation. ​The paper review process and all final decisions will be sent out quite as planned.

Paper Publication:

Submissions will be peer reviewed and evaluated based on originality, relevance to conference, contributions, and presentation. 

All accepted (Registered & Presented) papers of ICMIE 2020 will be collected into MATEC Web of Conferences (ISSN: 2261-236X), which is indexed by Ei Compendex, Inspec, DOAJ, Web of Science (CPCI), etc.

Conference Program:

Sep. 18, 2020-Sign in & Collect Conference Materials 

Sep. 19, 2020-Openning Remarks&Keynote Speeches (Morning)+Parallel Sessiones (Afternoon) 

Sep. 20, 2020-One day Visit 

Contact Us:

Conference Secretary : Ms. Zoe WU 
Email : icmie@academic.net 
Tel : +(86)-28-63023585 
Website : http://www.icmie.org/

Topics of interest include, but are not limited to:

*Measurement, Instruments & Test
Virtual Instrument
Scientific Experiment and Analytic Instrument
Educational Instrument & Experimental System
Microprocessor and Embedded System
VLSI Testing and Fault Diagnosis
MEMS Instruments and Test System
Testability and Built-in-test
Electronic Instrument & Measurement System
Optical Instrument & Measurement System
Precision Instruments & Measurement System

*Measurement & Test Information Processing
Measurement System and Theory
Measurement Error Theory
Virtual Measurement
Machine Learning and Pattern Recognition
Massive Data Management and Analysis
Reconfigurable Computing Sensors Fusion
Signal Analysis and Processing
Image Processing

*Measurement & Test Information Acquisition and Transmission
Sensors and Transducers
Non-electric Measurement
Sensor Network
Data Acquisition System and Technology
Signal Transmission and Data Bus
Networks in Test and Measurement
IOT: Internet of Things
Cyber Physical System

Topics of interest include, but are not limited to:

*Measurement, Instruments & Test
Virtual Instrument
Scientific Experiment and Analytic Instrument
Educational Instrument & Experimental System
Microprocessor and Embedded System
VLSI Testing and Fault Diagnosis
MEMS Instruments and Test System
Testability and Built-in-test
Electronic Instrument & Measurement System
Optical Instrument & Measurement System
Precision Instruments & Measurement System

*Measurement & Test Information Processing
Measurement System and Theory
Measurement Error Theory
Virtual Measurement
Machine Learning and Pattern Recognition
Massive Data Management and Analysis
Reconfigurable Computing Sensors Fusion
Signal Analysis and Processing
Image Processing

*Measurement & Test Information Acquisition and Transmission
Sensors and Transducers
Non-electric Measurement
Sensor Network
Data Acquisition System and Technology
Signal Transmission and Data Bus
Networks in Test and Measurement
IOT: Internet of Things
Cyber Physical System

John Mo

Fellow of IME and IEA

Shane Xie

University of Leeds, United Kingdom

IConf

Media Partner

John Mo

Fellow of IME and IEA

Shane Xie

University of Leeds, United Kingdom

IConf

Media Partner

Venue

Chengdu

Organizer

YOUNG

Venue

Chengdu

Organizer

YOUNG

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