2020 The 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)

Conference / Summit (onsite)
Artificial Intelligence (AI) & Machine Learning (ML)

Address: Nanjing, Nanjing, China
Date: 23 to 25 Oct '20

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ICICM-International Conference on Integrated Circuits and Microsystems is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems.

ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs.

Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.

The previous 4 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016 in Nanjing on November 8-11, 2017, and in Shanghai on November 24-26, 2018, Beijing on October 25-27,2019. 2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020) will return to Nanjing,China on October 23-25, 2020 with the support from University of Electronic Science and Technology of China and Southeast University, China.

Publication:

All accepted papers after proper presentation and registration will be collected in the IEEE conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference. 

Program Chairs:

Prof. Fei Yuan, Ryerson University, Canada; 

Prof. Zou Zhuo, Fudan University, China; 

Prof. Liu Dake, Beijing Institute of Technology, China | Link?ping University, Sweden; 

Assoc. Prof. Keping Wang, Southeast University, China. 


Steering Committee Chairs:

Prof. Huang Le Tian, University of Electronic Science and Technology of China, China; 

Prof. Dai Yong-Sheng, Nanjing University of Science & Technology, China; 

Prof. Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan. 


Conference Schedule:

1) October 23, 2020—Registration & Material Collecting 

2) October 24, 2020—Keynote & Invited Speeches & Papers Presentations 

3) October 25, 2020—Papers Presentations 


Conference Contact:

Ms Daisy Tseng 
Email: icicm@young.ac.cn 
Tel: +86-28-87777577

Thz and Microwave MicroSystem
Devices and Circuits for Wirless System
Application Specific Circuits and Systems for Communication
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

Thz and Microwave MicroSystem
Devices and Circuits for Wirless System
Application Specific Circuits and Systems for Communication
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

David Z. Pan

IEEE Fellow and SPIE Fellow

Ljiljana Trajkovic

IEEE Fellow

IConf

Media Partner

David Z. Pan

IEEE Fellow and SPIE Fellow

Ljiljana Trajkovic

IEEE Fellow

IConf

Media Partner

Venue

Nanjing

Organizer

youngnd

Venue

Nanjing

Organizer

youngnd

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