2021 IEEE International Conference on Electron Devices and Applications (ICEDA 2021)

Conference / Summit (onsite)
Electronics & Electrical

Address: Nanjing, Nanjing, China
Date: 14 to 16 Aug '21

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Conference Proceedings: 

Accepted papers will be published into ICEDA conference proceedings by IEEE. The proceedings will be submitted for inclusion into IEEE Xplore, Ei Compendex and Scopus. 

Speakers:

Prof. Juin J. Liou (IEEE Fellow), Shenzhen University, China
Prof. Xiaoqing Wen (IEEE Fellow), Kyushu Institute of Technology, Japan
Prof. Daohua Zhang, Nanyang Technological University, Singapore
Prof. Tayeb Mohammed-Brahim, University of Rennes 1, France
Assoc. Prof. Jun Wu, Southeast University, China
Prof. Shumin Xiao, Harbin Institute of Technology, Shenzhen, China
Prof. Byung Seong Bae, Hoseo University, Korea

Contact: 

Conference Secretary: Ms. Ariel Xie 

Email: icedaconf@vip.163.com 

Tel: +86-13103333332 (English&Chinese) 

2021 International Conference on Electron Devices and Applications (ICEDA 2021) will be held in Nanjing, China during May 29-31, 2021.

Electron devices are widely used in industry as well as our daily life, such as information processing, telecommunication, and signal processing. The world is growing at a fast rate and it is relevant for the technology enthusiast to upgrade with latest changes happening in the society. Moreover, it is difficult to spend few hours without electronics gadgets and they had become an important part of our everyday routine.

ICEDA 2021 is to bring together researchers and practitioners from electron devices and applications and related areas who are interested in developing, studying and using electron devices to share their research experiences and indulge in interactive discussions and communications at the event.

The proposed conference solicits original, unpublished and novel papers for research publication and presentation in research track, and industry/application papers in application track. Articles describing novel ideas in all areas of electron devices and applications are of interest, including the following:

  • CMOS platform technologies
  • Logic device performance and circuit design challenges
  • Advanced process integration schemes and scaling approaches
  • Process module and process control advancements
  • Device technology co-optimization solutions
  •  SiGe/Ge channel, GAA nanowire and stacked nanosheet
  • Stacked and monolithic 3D integration
  • BEOL compatible transistors
  • Heterogeneous optoelectronic integration (incl. sources, modulators)
  •  High-speed wafer-level photonic-electronic integration
  •  Organic and inorganic displays
  • Imagers (high time-resolution, high-sensitivity)
  • Large-scale optoelectronic integration for sensors
  • Thin film transistors, flexible, stretchable, and printed electronics
  • Optoelectronic integration for neuromorphic and quantum computing
  • VCSEL sensors, microLED, flexible displays
  • Technology CAD and benchmarking
  • Memory and alternative computing device modeling
  • Physics-based compact model
  • Atomistic process and device modeling
  • Design-oriented modeling: variability, reliability and yield
  • Atomistic-device hybrid modeling at large scale
  • Advanced integration and packaging modeling
  • Device and interconnect modeling for quantum computing

2021 International Conference on Electron Devices and Applications (ICEDA 2021) will be held in Nanjing, China during May 29-31, 2021.

Electron devices are widely used in industry as well as our daily life, such as information processing, telecommunication, and signal processing. The world is growing at a fast rate and it is relevant for the technology enthusiast to upgrade with latest changes happening in the society. Moreover, it is difficult to spend few hours without electronics gadgets and they had become an important part of our everyday routine.

ICEDA 2021 is to bring together researchers and practitioners from electron devices and applications and related areas who are interested in developing, studying and using electron devices to share their research experiences and indulge in interactive discussions and communications at the event.

The proposed conference solicits original, unpublished and novel papers for research publication and presentation in research track, and industry/application papers in application track. Articles describing novel ideas in all areas of electron devices and applications are of interest, including the following:

  • CMOS platform technologies
  • Logic device performance and circuit design challenges
  • Advanced process integration schemes and scaling approaches
  • Process module and process control advancements
  • Device technology co-optimization solutions
  •  SiGe/Ge channel, GAA nanowire and stacked nanosheet
  • Stacked and monolithic 3D integration
  • BEOL compatible transistors
  • Heterogeneous optoelectronic integration (incl. sources, modulators)
  •  High-speed wafer-level photonic-electronic integration
  •  Organic and inorganic displays
  • Imagers (high time-resolution, high-sensitivity)
  • Large-scale optoelectronic integration for sensors
  • Thin film transistors, flexible, stretchable, and printed electronics
  • Optoelectronic integration for neuromorphic and quantum computing
  • VCSEL sensors, microLED, flexible displays
  • Technology CAD and benchmarking
  • Memory and alternative computing device modeling
  • Physics-based compact model
  • Atomistic process and device modeling
  • Design-oriented modeling: variability, reliability and yield
  • Atomistic-device hybrid modeling at large scale
  • Advanced integration and packaging modeling
  • Device and interconnect modeling for quantum computing

Juin J. Liou

IEEE Fellow

Xiaoqing Wen

IEEE Fellow

IConf

Media Partner

Juin J. Liou

IEEE Fellow

Xiaoqing Wen

IEEE Fellow

IConf

Media Partner

Venue

Nanjing

Organizer

Chemical, Biological & Environmental Engineering Society

Venue

Nanjing

Organizer

Chemical, Biological & Environmental Engineering Society

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