2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)

Conference / Summit (onsite)
Electronics & Electrical

Address: Nanjing, Nanjing,China
Date: 22 to 24 Oct '21

Visit Event Website


Publication: Conference Proceeding 

All accepted papers after proper presentation and registration will be collected in the conference proceedings 

Indexed by: Ei Compendex, and Scopus, etc. 


Conference Chairs: 

Zhigong Wang, Southeast University, China 

Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter) 

    
Program Chairs: 

Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow) 

Zou Zhuo, Fudan University, China(Senior Member of IEEE) 

Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden 


Conference schedule: 

1) October 22, 2021—Conference Materials Collection 

2) October 23, 2021—Keynote Speeches & Authors' Presentations 

3) October 24, 2021—Keynote/Invited Speeches & Authors' Presentations & Poster Presentations 


Conference Contact: 

Ms Zeng 

Email: icicm@young.ac.cn 

Tel: +86-28-87777577

ICICM-International Conference on Integrated Circuits and Microsystems is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs. Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.

Conference Scope


  • Thz and Microwave MicroSystem
  • Devices and Circuits for Wirless System
  • Application Specific Circuits and Systems for Communication
  • Digital, Analog, Mixed Signal IC and SOC design technology
  • Silicon integrated circuits and manufacturing
  • Low-power, RF devices & circuits
  • IC Computer-Aided –Design technology, DFM
  • Silicon/germanium devices and device physics
  • Interconnect, Low K, High K and other process technologies
  • Unconventional and nano-electronics
  • Organic semiconductor devices and technologies
  • Compound semiconductor devices and circuits
  • Displays, sensors and MEMS
  • Semiconductor materials and material characterization
  • Packaging and testing technology
  • Solar cell & other devices for new energy sources
  • Modeling and simulation
  • Equipment technology
  • Reliability
  • Displays, sensors and MEMS
  • Advance memories technology
  • (Flash, FeRAM, PCM,ReRAM, MRAM etc.)


ICICM-International Conference on Integrated Circuits and Microsystems is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs. Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.

Conference Scope


  • Thz and Microwave MicroSystem
  • Devices and Circuits for Wirless System
  • Application Specific Circuits and Systems for Communication
  • Digital, Analog, Mixed Signal IC and SOC design technology
  • Silicon integrated circuits and manufacturing
  • Low-power, RF devices & circuits
  • IC Computer-Aided –Design technology, DFM
  • Silicon/germanium devices and device physics
  • Interconnect, Low K, High K and other process technologies
  • Unconventional and nano-electronics
  • Organic semiconductor devices and technologies
  • Compound semiconductor devices and circuits
  • Displays, sensors and MEMS
  • Semiconductor materials and material characterization
  • Packaging and testing technology
  • Solar cell & other devices for new energy sources
  • Modeling and simulation
  • Equipment technology
  • Reliability
  • Displays, sensors and MEMS
  • Advance memories technology
  • (Flash, FeRAM, PCM,ReRAM, MRAM etc.)


David Z. Pan

IEEE Fellow and SPIE Fellow

Ljiljana Trajkovic

IEEE Fellow

IConf

Media Partner

David Z. Pan

IEEE Fellow and SPIE Fellow

Ljiljana Trajkovic

IEEE Fellow

IConf

Media Partner

Venue

Nanjing

Organizer

youngnd

Venue

Nanjing

Organizer

youngnd

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