Advisors:
IEEE/CEDA, ACM/SIGDA
Department of Information Science, National Natural Science Foundation of China (NSFC)
Chinese Institute of Electronics (CIE)
Steering Committee, Major Plan of “Fundamental Research on Post-Moore Novel Devices”
Organizer:
EDA Ecosystem Development Accelerator (EDA²)
EDA Committee of CIE
Co-Organizers:
The Chinese University of Hong Kong
Peking University
Southeast University
Tsinghua University
Xidian University
Committees
【Executive Committee】
General Chair：
Yue Hao, Professor of Xidian University, Academician of the Chinese Academy of Sciences
【Steering Committee】
Shaojun Wei, Tsinghua University
Xuan Zeng, Fudan University
Patrick Girard, French National Center for Scientific Research
Jamal Deen, McMaster University
Yankin Tanurhan, Synopsys
【Technical Program Committee】
Conference Chairs：
Tsung-Yi Ho, The Chinese University of Hong Kong
Runsheng Wang, Peking University
Gang Qu, University of Maryland
Technical Program Chairs：
Bei Yu, The Chinese University of Hong Kong
Yun Liang, Peking University
Ulf Schlichtmann, Technical University of Munich
Special Session Chair:
Wenjian Yu, Tsinghua University
Industrial Session Chair:
Fan Yang , Shenzhen GWX Technology Co.,Ltd.
Tutorial/Training Chair:
Zuochang Ye, Tsinghua University
Finance Chair:
Gang Chen, Nanjing Industrial Innovation Center of EDA
Panel Chair:
Yibo Lin, Peking University
Publication Chair:
Qiang Xu, The Chinese University of Hong Kong
Industry Liaison:
Yutao Ma, Primarius Technologies Co.,Ltd
Publicity Chair:
Xin Li, Duke Kunshan University
Outreach Chairs:
[US] Hai Zhou, Northwestern University
[Canada] Peter Chun, University of Alberta
[Europe] Zebo Peng, Linköping University
[Asia] Xiaoqing Wen, Kyushu Institute of Technology
Track Committee:
1. System-Level Modeling and Design Methodology
Chair: Jieru Zhao, Shanghai Jiao Tong University
Co-Chair: Qi Sun, Zhejiang University
2. Memory Architecture and Near/In Memory Computing
Chair: Xiaoming Chen, Institute of Computing Technology, CAS
Co-Chair: Li Du, Nanjing University
3. Analog-Mixed Signal Design Automation
Chair: Fan Yang, Fudan University
Co-Chair: Keren Zhu, Fudan University
4. High-Level, Behavioral, and Logic Synthesis and Optimization
Chair: Zhufei Chu, Ningbo University
Co-Chair: Weikang Qian, Shanghai Jiao Tong University
5. Analysis and Optimization for Power and Timing
Chair: Yibo Lin, Peking University
Co-Chair: Zhiyao Xie, HKUST
6. Physical Implementation
Chair: Hailong Yao, University of Science and Technology Beijing
Co-Chair: Yuzhe Ma, HKUST (GZ)
7. Testing, Validation, Simulation, and Verification
Chair: Huawei Li, Institute of Computing Technology, CAS
Co-Chair: Hongce Zhang, HKUST (GZ)
8. Design for Manufacturability and Reliability
Chair: Lan Chen, Institute of Microelectronics, CAS
Co-Chair: Yu-Guang Chen, National Central University
9. Packaging & Multi-Physics Simulation
Chair: Hongliang Lu, Xidian University
Co-Chair: Yarui Peng, University of Arkansas
10. Technology & Modeling
Chair: Lining Zhang, Peking University
Co-Chair: Hao Yan, Southeast University
11. Emerging Technologies and Applications
Chair: Xiangshui Miao, HUST
Co-Chair: Hailong You, Xidian University
12. AI & Open Source EDA
Chair: Guojie Luo, Peking University
Co-Chair: Xingquan Li , Peng Cheng Laboratory
Keynote Speakers:
Giovanni De Micheli, École polytechnique fédérale de Lausanne
Tim Kwang-Ting CHENG, The Hong Kong University of Science and Technology
Sung-Kyu Lim, Georgia Institute of Technology
Jaijeet Roychowdhury, University of California, Berkeley
Sachin Sapatnekar, University of Minnesota
Ulf Schlichtmann, Technical University of Munich
Jinjun Xiong, University of Buffalo
Contact Us:
Conference Secretary: Ms. Joyce Zhong
Phone: +86 186 2826 3876
Email: iseda@eda2.com
Yu Huang | huangyu61@hisilicon.com
IEEE/CEDA, ACM/SIGDA
Department of Information Science, National Natural Science Foundation of China (NSFC)
Chinese Institute of Electronics (CIE)
Steering Committee, Major Plan of “Fundamental Research on Post-Moore Novel Devices”
Organizer:
EDA Ecosystem Development Accelerator (EDA²)
EDA Committee of CIE
Co-Organizers:
The Chinese University of Hong Kong
Peking University
Southeast University
Tsinghua University
Xidian University
Committees
【Executive Committee】
General Chair：
Yue Hao, Professor of Xidian University, Academician of the Chinese Academy of Sciences
【Steering Committee】
Shaojun Wei, Tsinghua University
Xuan Zeng, Fudan University
Patrick Girard, French National Center for Scientific Research
Jamal Deen, McMaster University
Yankin Tanurhan, Synopsys
【Technical Program Committee】
Conference Chairs：
Tsung-Yi Ho, The Chinese University of Hong Kong
Runsheng Wang, Peking University
Gang Qu, University of Maryland
Technical Program Chairs：
Bei Yu, The Chinese University of Hong Kong
Yun Liang, Peking University
Ulf Schlichtmann, Technical University of Munich
Special Session Chair:
Wenjian Yu, Tsinghua University
Industrial Session Chair:
Fan Yang , Shenzhen GWX Technology Co.,Ltd.
Tutorial/Training Chair:
Zuochang Ye, Tsinghua University
Finance Chair:
Gang Chen, Nanjing Industrial Innovation Center of EDA
Panel Chair:
Yibo Lin, Peking University
Publication Chair:
Qiang Xu, The Chinese University of Hong Kong
Industry Liaison:
Yutao Ma, Primarius Technologies Co.,Ltd
Publicity Chair:
Xin Li, Duke Kunshan University
Outreach Chairs:
[US] Hai Zhou, Northwestern University
[Canada] Peter Chun, University of Alberta
[Europe] Zebo Peng, Linköping University
[Asia] Xiaoqing Wen, Kyushu Institute of Technology
Track Committee:
1. System-Level Modeling and Design Methodology
Chair: Jieru Zhao, Shanghai Jiao Tong University
Co-Chair: Qi Sun, Zhejiang University
2. Memory Architecture and Near/In Memory Computing
Chair: Xiaoming Chen, Institute of Computing Technology, CAS
Co-Chair: Li Du, Nanjing University
3. Analog-Mixed Signal Design Automation
Chair: Fan Yang, Fudan University
Co-Chair: Keren Zhu, Fudan University
4. High-Level, Behavioral, and Logic Synthesis and Optimization
Chair: Zhufei Chu, Ningbo University
Co-Chair: Weikang Qian, Shanghai Jiao Tong University
5. Analysis and Optimization for Power and Timing
Chair: Yibo Lin, Peking University
Co-Chair: Zhiyao Xie, HKUST
6. Physical Implementation
Chair: Hailong Yao, University of Science and Technology Beijing
Co-Chair: Yuzhe Ma, HKUST (GZ)
7. Testing, Validation, Simulation, and Verification
Chair: Huawei Li, Institute of Computing Technology, CAS
Co-Chair: Hongce Zhang, HKUST (GZ)
8. Design for Manufacturability and Reliability
Chair: Lan Chen, Institute of Microelectronics, CAS
Co-Chair: Yu-Guang Chen, National Central University
9. Packaging & Multi-Physics Simulation
Chair: Hongliang Lu, Xidian University
Co-Chair: Yarui Peng, University of Arkansas
10. Technology & Modeling
Chair: Lining Zhang, Peking University
Co-Chair: Hao Yan, Southeast University
11. Emerging Technologies and Applications
Chair: Xiangshui Miao, HUST
Co-Chair: Hailong You, Xidian University
12. AI & Open Source EDA
Chair: Guojie Luo, Peking University
Co-Chair: Xingquan Li , Peng Cheng Laboratory
Keynote Speakers:
Giovanni De Micheli, École polytechnique fédérale de Lausanne
Tim Kwang-Ting CHENG, The Hong Kong University of Science and Technology
Sung-Kyu Lim, Georgia Institute of Technology
Jaijeet Roychowdhury, University of California, Berkeley
Sachin Sapatnekar, University of Minnesota
Ulf Schlichtmann, Technical University of Munich
Jinjun Xiong, University of Buffalo
Contact Us:
Conference Secretary: Ms. Joyce Zhong
Phone: +86 186 2826 3876
Email: iseda@eda2.com
Yu Huang | huangyu61@hisilicon.com
