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2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026)

13 – 15 Nov 2026·China

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VF97.4.
电气与电子计算设备与操作系统

2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026)

  • 日期

    13 - 15 November 2026

  • 地点

    Shanghai, China

  • 活动类型

    会议与峰会

  • 呈现方式

    混合形式(现场和线上)

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2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026) 徽标
Conference Awards:
Young Scientist Award
Best Student Paper Award
Outstanding Organization Award
Best Oral Presentation Award
Best Poster Presentation Award
Outstanding Reviewer Awards

Proceedings:
All papers submitted to ICCSD that fall within its technical scope will be published in the Conference Proceedings, and at least one author of each accepted paper is expected to present at the conference.

ICCSD 2021: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.
ICCSD 2020: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.
ICCSD 2019: ISBN: 978-1-7281-3062-0. IEEE Xplore, indexed by Ei Compendex & Scopus.
ICCSD 2018: ISBN: 978-1-5386-8311-8. IEEE Xplore, indexed by Ei Compendex & Scopus.
ICCSD 2017: ISBN: 978-1-5386-1870-7. IEEE Xplore, indexed by Ei Compendex & Scopus.

Call for Papers:
Track 1: Microelectronic Devices
Advanced Transistors(GAAFETs/ VSAFETs)
Wide Bandgap Semiconductor Devices
Quantum Devices
Compound Semiconductor Devices
Spintronic Devices

Track 2: Power Devices and Power Management
Insulated-Gate Bipolar Transistor (IGBT)
Power MOSFET
Silicon Carbide(SiC)
Nano Energy Devices
Energy Conversion Devices
Energy Harvesting Technology
DC-DC Converter
Power Management & Energy Efficient Technology

 Track 3: Sensors and Displays
Bio/Gas/Thermal/Voltage/Current Sensors
Vision Intelligence & Image Sensors
Acoustic Sensors
Display Technology & Devices
Photoelectric Conversion & Optical Fiber Sensing

Track 4: Electromagnetics & Microwave Devices
Power Amplifiers
Mixer & Microwave Sources
Terahertz Devices
Magnetic Devices
Electromagnetic Components
Antenna Design
Terahertz Sensing and Imaging
Computational Electromagnetics

Track 5: 3D Integration & Microsystems
System in Package(SiP)
Through Glass Via & Through Silicon Via
3D Integration Technology
High Density Packaging
CAD Tools for Packing
Microelectromechanical Systems
Photoelectric Fusion Module
Chiplets Based Microsystems
Wafer-Scale Integration & System on Wafer

Track 6: Digital Devices & VLSI Physical Design
Nonvolatile Memory
Computing in Memory
Emerging Memory Technologies
Clock Generator and Management
Physical Modeling for VLSI Design
Placement & Routing Algorithm
Evaluation Methods for VLSI Reliability
Aging Prediction & Mitigation
more details: https://iccsd.net/cfp.html

Call for Special Session:
Special Sessions may address one or more Tracks, but they should be Organized under a unified theme. Special Sessions are intended to allow projects or any other group of authors to present their own work. It is not expected that open calls for papers are launched for Special Sessions, in order to attract authors or presenters.
Special Sessions will be evaluated according to the following criteria:
– Relevance
– Timeliness
– Technical content
– Novelty
– Overall Recommendation
more details: https://iccsd.net/ss.html

Submission:
Make a submission: https://www.zmeeting.org/submission/iccsd2026
more details: https://iccsd.net/submission.html

Contact us:
Dr. Fidelia Lee
E-mail: iccsd@academic.net

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演讲嘉宾

聆听塑造 电气与电子 的世界级声音。

  • Juin J. Liou

    IEEE Fellow

  • Yu Wang

    IEEE Fellow

Sponsors & Partners

We're proud to partner with industry leaders supporting this event.

媒体合作伙伴

  • IConf logo

    IConf

活动地点与场馆

加入我们,来到这个旨在激发有意义连接的世界级场馆。

地点

Ningbo, China

Shanghai, China

日期与时间

13 - 15 November 2026

获取路线
CZES-nd 徽标

主办方

CZES-nd

Corporate

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