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2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026)

13 – 15 Nov 2026·China

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Electricidad y electrónicaDispositivos informáticos y sistemas operativos

2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026)

ICCSD 2026

  • Fecha

    13 - 15 November 2026

  • Ubicación

    Shanghai, China

  • Tipo de evento

    Conferencias y cumbres

  • Formato de entrega

    Híbrido (presencial y en línea)

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Logo 2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026)

Conference Awards

Young Scientist Award

Best Student Paper Award

Outstanding Organization Award

Best Oral Presentation Award

Best Poster Presentation Award

Outstanding Reviewer Awards

Proceedings:

After a careful reviewing process, all accepted papers after proper registration and presentation, will be published by IEEE Conference Proceedings, which will be included in IEEE Xplore, and submitted for indexing of Ei Compendex & Scopus after conference.

ICCSD 2021: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.

ICCSD 2020: Online ISSN: 1742-6596. online, indexed by Ei Compendex & Scopus.

ICCSD 2019: ISBN: 978-1-7281-3062-0. IEEE Xplore, indexed by Ei Compendex & Scopus.

ICCSD 2018: ISBN: 978-1-5386-8311-8. IEEE Xplore, indexed by Ei Compendex & Scopus.

ICCSD 2017: ISBN: 978-1-5386-1870-7. IEEE Xplore, indexed by Ei Compendex & Scopus.

Call for Papers

Track 1: Microelectronic Devices

Advanced Transistors(GAAFETs/ VSAFETs)

Wide Bandgap Semiconductor Devices

Quantum Devices

Compound Semiconductor Devices

Spintronic Devices

Track 2: Power Devices and Power Management

Insulated-Gate Bipolar Transistor (IGBT)

Power MOSFET

Silicon Carbide(SiC)

Nano Energy Devices

Energy Conversion Devices

Energy Harvesting Technology

DC-DC Converter

Power Management & Energy Efficient Technology

Track 3: Sensors and Displays

Bio/Gas/Thermal/Voltage/Current Sensors

Vision Intelligence & Image Sensors

Acoustic Sensors

Display Technology & Devices

Photoelectric Conversion & Optical Fiber Sensing

Track 4: Electromagnetics & Microwave Devices

Power Amplifiers

Mixer & Microwave Sources

Terahertz Devices

Magnetic Devices

Electromagnetic Components

Antenna Design

Terahertz Sensing and Imaging

Computational Electromagnetics

Track 5: 3D Integration & Microsystems

System in Package(SiP)

Through Glass Via & Through Silicon Via

3D Integration Technology

High Density Packaging

CAD Tools for Packing

Microelectromechanical Systems

Photoelectric Fusion Module

Chiplets Based Microsystems

Wafer-Scale Integration & System on Wafer

Track 6: Digital VLSI and Memory Systems

Low-Power Digital Circuits

Memory Devices and Circuit Design

In-Memory Computing Architectures

AI and Machine Learning Hardware

SoC and 3D Heterogeneous Integration

Hardware Security for VLSI Systems

Emerging Post-CMOS Technologies

VLSI Physical Design and EDA

more details: https://iccsd.net/cfp.html

Call for Special Session

Special Sessions may address one or more Tracks, but they should be Organized under a unified theme. Special Sessions are intended to allow projects or any other group of authors to present their own work. It is not expected that open calls for papers are launched for Special Sessions, in order to attract authors or presenters.

Special Sessions will be evaluated according to the following criteria:

– Relevance

– Timeliness

– Technical content

– Novelty

– Overall Recommendation

more details: https://iccsd.net/ss.html

Submission

Make a submission: https://www.zmeeting.org/submission/iccsd2026

more details: https://iccsd.net/submission.html

Contact us

Dr. Fidelia Lee

E-mail: iccsd@academic.net

Precios e inscripción

Costo de asistencia

$100-500

USD por asistente

Registrarse para asistir

Precios e inscripción

Costo de asistencia

$100-500

USD por asistente

Registrarse para asistir

Manténgase conectado con el evento

Siga el evento para actualizaciones y anuncios

Visitar el sitio web del evento

Ponentes

Escuche a voces de primer nivel que están dando forma a Electricidad y electrónica.

  • Juin J. Liou

    IEEE Fellow

  • Yu Wang

    IEEE Fellow

Sponsors & Partners

We're proud to partner with industry leaders supporting this event.

Socio de medios

  • IConf logo

    IConf

Ubicación y sede del evento

Únase a nosotros en esta sede de primer nivel diseñada para inspirar conexiones significativas.

Ubicación

Ningbo, China

Shanghai, China

Fecha y hora

13 - 15 November 2026

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