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2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026)

11 – 13 Dec 2026·China

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VF103.19.
Industry Events

全球最值得信赖的B2B活动发现平台。将行业专业人士与重要的会议、展会和峰会连接起来。

  • Industry Events
  • 新闻
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  • 我们的服务
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  • 成为演讲者
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  • 使用条款
  • 隐私政策

© 2026 Industry Events Worldwide。保留所有权利。

VF103.19.
消费电子电气与电子

2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026)

ICEDA 2026

  • 日期

    11 - 13 December 2026

  • 地点

    Shenzhen, China

  • 活动类型

    会议与峰会

  • 呈现方式

    混合形式(现场和线上)

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2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026) 徽标

Publication:

All papers will be strictly double blind reviewed by the program committee and reviewers, and accepted papers will be published into conference proceedings by IEEE after registration and presentation. The proceedings will be submitted for inclusion into IEEE Xplore and indexed by Ei Compendex & Scopus.

ICEDA 2026 has been included in the official list of IEEE conferences! https://conferences.ieee.org/conferences_events/conferences/conferencedetails/71709

Topics (Topics of interest for submission include, but are not limited to:)

Track 1: Semiconductor Devices & Materials

Advanced semiconductor materials (SiC, GaN, 2D materials)

High-performance transistors (FinFET, GAA, TFET)

Power semiconductor devices and modules

MEMS/NEMS devices and sensors

Track 2: Integrated Circuits & VLSI Design

Analog/mixed-signal IC design

RF and millimeter-wave integrated circuits

Low-power and energy-efficient ICs

3D/heterogeneous integration technologies

Track 3: Optoelectronics & Photonic Devices

Photodetectors and image sensors

LEDs, lasers, and display technologies

Silicon photonics and plasmonics

Optical communication devices

Track 4: Power Electronics & Energy Devices

Power converters and inverters

Energy harvesting devices and systems

Battery management systems (BMS)

Electric vehicle power electronics

Track 5: Emerging Technologies & Applications

Quantum computing devices

Bioelectronics and implantable devices

Wearable and IoT sensor technologies

Printed and large-area electronics

Track 6: Device Modeling, Fabrication & Reliability

Circuits, Devices and Systems

Compact modeling of electron devices

Process simulation and TCAD tools

Advanced lithography and nanofabrication

For more topics, please visit: https://www.iceda.org/cfp.html.

Submission Instructions

1. English is the official language. Paper should be written and presented only in English.

2. If you want to make a presentation and publish your paper, submit a full paper (5-6 pages, two columns); just want to make a presentation, abstract (200-400 words) is enough.

3. If the length of the full paper exceeds 6 pages, extra page will be charged at 60 USD/400 RMB/Page.

4. Submission:

1) By online submission system: https://confsys.iconf.org/submission/iceda2026

2) By Email: iceda_contact@163.com

3) Template: Please format your paper according to the template (https://www.iceda.org/download/template.docx) before submission.

General Program

The detailed conference program is to be available online at the late of November 2026. For your convenience, schedule at a glance is given below.

Day 1 - December 11, 2026

-10:00-17:00 | Onsite Registration & Materials Collection

Day 2 - December 12, 2026

-09:00-12:00 | Opening Remark and Keynote Speeches

-12:00-13:30 | Lunch

-13:30-18:00 | Parallel Sessions

-18:00-19:30 | Dinner Banquet

Day 3 - December 13, 2026

-09:00-15:00 | Parallel Sessions

Contact us

Conference secretary: Miss Adela Zhong

Email: iceda_contact@163.com

Tel: +86-19180927671

Website: https://www.iceda.org/

价格与注册

参会费

$100-500

USD / 每位参会��

注册参会

价格与注册

参会费

$100-500

USD / 每位参会��

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与活动保持联系

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Sponsors & Partners

We're proud to partner with industry leaders supporting this event.

媒体合作伙伴

  • IConf logo

    IConf

活动地点与场馆

加入我们,来到这个旨在激发有意义连接的世界级场馆。

地点

Shenzhen, China

Shenzhen, China

日期与时间

11 - 13 December 2026

时区

GMT+8 (Shanghai)

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IA

主办方

International Association of Computer Science & Information Technology

Corporate

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