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2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026)

11 – 13 Dec 2026·China

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  4. 2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026)

2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026)

11 Dec 2026 · Shenzhen

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VF87.1.
Electrónica de consumoElectricidad y electrónica

2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026)

ICEDA 2026

  • Fecha

    11 - 13 December 2026

  • Ubicación

    Shenzhen, China

  • Tipo de evento

    Conferencias y cumbres

  • Formato de entrega

    Híbrido (presencial y en línea)

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Logo 2026 The 6th International Conference on Electron Devices and Applications (ICEDA 2026)

Publication:

All papers will be strictly double blind reviewed by the program committee and reviewers, and accepted papers will be published into conference proceedings by IEEE after registration and presentation. The proceedings will be submitted for inclusion into IEEE Xplore and indexed by Ei Compendex & Scopus.

ICEDA 2026 has been included in the official list of IEEE conferences! https://conferences.ieee.org/conferences_events/conferences/conferencedetails/71709

Topics (Topics of interest for submission include, but are not limited to:)

Track 1: Semiconductor Devices & Materials

Advanced semiconductor materials (SiC, GaN, 2D materials)

High-performance transistors (FinFET, GAA, TFET)

Power semiconductor devices and modules

MEMS/NEMS devices and sensors

Track 2: Integrated Circuits & VLSI Design

Analog/mixed-signal IC design

RF and millimeter-wave integrated circuits

Low-power and energy-efficient ICs

3D/heterogeneous integration technologies

Track 3: Optoelectronics & Photonic Devices

Photodetectors and image sensors

LEDs, lasers, and display technologies

Silicon photonics and plasmonics

Optical communication devices

Track 4: Power Electronics & Energy Devices

Power converters and inverters

Energy harvesting devices and systems

Battery management systems (BMS)

Electric vehicle power electronics

Track 5: Emerging Technologies & Applications

Quantum computing devices

Bioelectronics and implantable devices

Wearable and IoT sensor technologies

Printed and large-area electronics

Track 6: Device Modeling, Fabrication & Reliability

Circuits, Devices and Systems

Compact modeling of electron devices

Process simulation and TCAD tools

Advanced lithography and nanofabrication

For more topics, please visit: https://www.iceda.org/cfp.html.

Submission Instructions

1. English is the official language. Paper should be written and presented only in English.

2. If you want to make a presentation and publish your paper, submit a full paper (5-6 pages, two columns); just want to make a presentation, abstract (200-400 words) is enough.

3. If the length of the full paper exceeds 6 pages, extra page will be charged at 60 USD/400 RMB/Page.

4. Submission:

1) By online submission system: https://confsys.iconf.org/submission/iceda2026

2) By Email: iceda_contact@163.com

3) Template: Please format your paper according to the template (https://www.iceda.org/download/template.docx) before submission.

General Program

The detailed conference program is to be available online at the late of November 2026. For your convenience, schedule at a glance is given below.

Day 1 - December 11, 2026

-10:00-17:00 | Onsite Registration & Materials Collection

Day 2 - December 12, 2026

-09:00-12:00 | Opening Remark and Keynote Speeches

-12:00-13:30 | Lunch

-13:30-18:00 | Parallel Sessions

-18:00-19:30 | Dinner Banquet

Day 3 - December 13, 2026

-09:00-15:00 | Parallel Sessions

Contact us

Conference secretary: Miss Adela Zhong

Email: iceda_contact@163.com

Tel: +86-19180927671

Website: https://www.iceda.org/

Precios e inscripción

Costo de asistencia

$100-500

USD por asistente

Registrarse para asistir

Precios e inscripción

Costo de asistencia

$100-500

USD por asistente

Registrarse para asistir

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Siga el evento para actualizaciones y anuncios

Visitar el sitio web del evento

Sponsors & Partners

We're proud to partner with industry leaders supporting this event.

Socio de medios

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    IConf

Ubicación y sede del evento

Únase a nosotros en esta sede de primer nivel diseñada para inspirar conexiones significativas.

Ubicación

Shenzhen, China

Shenzhen, China

Fecha y hora

11 - 13 December 2026

Zona horaria

GMT+8 (Shanghai)

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Organizado por

International Association of Computer Science & Information Technology

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