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2027 10th International Conference on Smart Materials Applications (ICSMA 2027)

8 – 10 Jan 2027·Japan

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VF106.3.
Industry Events

全球最值得信赖的B2B活动发现平台。将行业专业人士与重要的会议、展会和峰会连接起来。

  • Industry Events
  • 新闻
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  • 隐私政策

© 2026 Industry Events Worldwide。保留所有权利。

VF106.3.
先进制造与材料纳米技术与智能材料

2027 10th International Conference on Smart Materials Applications (ICSMA 2027)

ICSMA 2027

  • 日期

    8 - 10 January 2027

  • 地点

    Sapporo, Japan

  • 活动类型

    会议与峰会

  • 呈现方式

    混合形式(现场和线上)

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2027 10th International Conference on Smart Materials Applications (ICSMA 2027) 徽标

Committees

Conference Committee Chairs

Prof. Kazuo Umemura, Tokyo University of Science, Japan

Prof. Jong Hak Kim, Yonsei University, South Korea

Prof. Xiaohong Zhu, Sichuan University, China

Program Committee Chairs

Assoc. Prof. Jung Tae Park, Yonsei University, South Korea

Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore

Dr. Seok-Keun Koh, C&G Hitech Co., Ltd, Korea

Conference Proceedings:

All submissions will be peer reviewed, the registered and presented papers will be published in the journals of Scientific.Net(https://www.scientific.net/) collection. Indexed by Elsevier: SCOPUS.

History of ICSMA

ICSMA 2026 | JANUARY 28-30, 2026 | TOKYO UNIVERSITY OF SCIENCE, JAPAN

ICSMA 2025 | JANUARY 08-10, 2025 | YONSEI UNIVERSITY, SOUTH KOREA

ICSMA 2024 | JANUARY 14-16, 2024 | SINGAPORE

ICSMA 2023 | JANUARY 06-08, 2023 | TOKYO, JAPAN

ICSMA 2022 | JANUARY 21-24, 2022 | VIRTUAL CONFERENCE

ICSMA 2021 | JANUARY 21-24, 2021 | VIRTUAL CONFERENCE

ICSMA 2020 | JANUARY 13-16, 2020 | YONSEI UNIVERSITY, SOUTH KOREA

ICSMA 2019 | JANUARY 19-22, 2019 | TOKYO, JAPAN

ICSMA 2018 | JANUARY 26-28, 2018 | SINGAPORE

Call for Papers

(01) Smart & Functional Materials

(02) Material Properties & Characterization

(03) Manufacturing & Processing

(04) Computational & AI-Driven Approaches

(05) Applications & Sustainability

For more topics, please visit: https://www.icsma.org/cfp.html

Submission

Please upload your abstract/full paper to iconf. Submission System (http://confsys.iconf.org/submission/icsma2027). Any questions, please feel free to contact via icsma@saise.org.

1. Full Paper (Presentation and Publication)

Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding.

2. Abstract (Presentation only)

Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published.

For more details, please visit: https://www.icsma.org/submission.html

Conference Schedule

2027.01.08: Sign-in & Conference Kit Collection

2027.01.09: Opening Ceremony, Keynote Speeches, Parallel Sessions, Dinner Banquet

2027.01.10: Parallel Sessions, Tour/Visit (Optional)

Contact Us

Ms. Sia Fan

Email: icsma@saise.org

Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)

价格与注册

参会费

$100-500

USD / 每位参会��

注册参会

价格与注册

参会费

$100-500

USD / 每位参会��

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活动地点与场馆

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地点

Sapporo, Japan

Sapporo, Japan

日期与时间

8 - 10 January 2027

时区

GMT+9 (Tokyo)

获取路线
SA

主办方

South Asia Institute of Science and Engineering

Corporate

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