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2027 10th International Conference on Smart Materials Applications (ICSMA 2027)

8–10 Jan 2027·Japan

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Manufactura y materiales avanzadosNanotecnología y materiales inteligentesElectricidad y electrónica

2027 10th International Conference on Smart Materials Applications (ICSMA 2027)

ICSMA 2027

  • Fecha

    8–10 Jan 2027

  • Ubicación

    Sapporo, Japan

  • Tipo de evento

    Conferencias y cumbres

  • Formato de entrega

    Híbrido (presencial y en línea)

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Logo 2027 10th International Conference on Smart Materials Applications (ICSMA 2027)

Committees

Conference Committee Chairs

Prof. Kazuo Umemura, Tokyo University of Science, Japan

Prof. Jong Hak Kim, Yonsei University, South Korea

Prof. Xiaohong Zhu, Sichuan University, China

Program Committee Chairs

Assoc. Prof. Jung Tae Park, Yonsei University, South Korea

Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore

Dr. Seok-Keun Koh, C&G Hitech Co., Ltd, Korea

Conference Proceedings:

All submissions will be peer reviewed, the registered and presented papers will be published in the journals of Scientific.Net(https://www.scientific.net/) collection. Indexed by Elsevier: SCOPUS.

History of ICSMA

ICSMA 2026 | JANUARY 28-30, 2026 | TOKYO UNIVERSITY OF SCIENCE, JAPAN

ICSMA 2025 | JANUARY 08-10, 2025 | YONSEI UNIVERSITY, SOUTH KOREA

ICSMA 2024 | JANUARY 14-16, 2024 | SINGAPORE

ICSMA 2023 | JANUARY 06-08, 2023 | TOKYO, JAPAN

ICSMA 2022 | JANUARY 21-24, 2022 | VIRTUAL CONFERENCE

ICSMA 2021 | JANUARY 21-24, 2021 | VIRTUAL CONFERENCE

ICSMA 2020 | JANUARY 13-16, 2020 | YONSEI UNIVERSITY, SOUTH KOREA

ICSMA 2019 | JANUARY 19-22, 2019 | TOKYO, JAPAN

ICSMA 2018 | JANUARY 26-28, 2018 | SINGAPORE

Call for Papers

(01) Smart & Functional Materials

(02) Material Properties & Characterization

(03) Manufacturing & Processing

(04) Computational & AI-Driven Approaches

(05) Applications & Sustainability

For more topics, please visit: https://www.icsma.org/cfp.html

Submission

Please upload your abstract/full paper to iconf. Submission System (http://confsys.iconf.org/submission/icsma2027). Any questions, please feel free to contact via icsma@saise.org.

1. Full Paper (Presentation and Publication)

Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding.

2. Abstract (Presentation only)

Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published.

For more details, please visit: https://www.icsma.org/submission.html

Conference Schedule

2027.01.08: Sign-in & Conference Kit Collection

2027.01.09: Opening Ceremony, Keynote Speeches, Parallel Sessions, Dinner Banquet

2027.01.10: Parallel Sessions, Tour/Visit (Optional)

Contact Us

Ms. Sia Fan

Email: icsma@saise.org

Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)

Precios e inscripción

Costo de asistencia

$100-500

USD por asistente

Registrarse para asistir

Precios e inscripción

Costo de asistencia

$100-500

USD por asistente

Registrarse para asistir

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Ubicación y sede del evento

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Ubicación

Sapporo, Japan

Sapporo, Japan

Fecha y hora

8–10 Jan 2027

Zona horaria

GMT+9 (Tokyo)

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SA

Organizado por

South Asia Institute of Science and Engineering

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