DIGITIMES

Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

作者 DIGITIMES

1 分钟阅读
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

有活动行业的新闻要分享吗?

提交新闻稿或信息,触达数千名活动行业专业人士。

联系我们→

更多Semiconductors & Microelectronics相关内容

相关洞察