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DIGITIMES
AI capacity crunch drives up consumer tech costs, deepening China's deflation
DIGITIMES
Interview: Advanced packaging shifts toward system-level co-design for AI
Semiconductor Engineering
Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)
DIGITIMES
Amazon Leo clears Taiwan's NCC review, with commercial launch pointed at 2027
Semiconductor Engineering
Chiplet Co-Design Framework Reduces Energy and Design Costs for AI Accelerators (University of Michigan)
DIGITIMES
Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27
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