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DIGITIMES
AUO subsidiary Darwin shifts toward high-end manufacturing, explores CPO and semiconductor opportunities
DIGITIMES
India's chip packaging plants start exporting, but scale, skills, and subsidies test the next phase
DIGITIMES
Microsoft readies Windows for AI agents as third-party agents such as Meta's Muse spread
EE Times
Why AI’s Limit Is Power, Not Chips: Gopi Sirineni at AI Infra Summit 2026
DIGITIMES
Sasken eyes reusable chip IP as India pushes beyond semiconductor design services
IEEE Spectrum
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