From Wafers to Panels: Overcoming Lithography Challenges in Advanced Packaging

Unlike front-end lithography, packaging lithography typically works at feature sizes around 1 µm, so overlay accuracy, throughput and thermal stability matter more than ever-smaller CDs, and those demands grow as substrates move from 300mm wafers to panels as large as 600 x 600mm. The post From Wafers to Panels: Overcoming Lithography Challenges in Advanced Packaging appeared first on Semiconductor Digest.