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DIGITIMES
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
EE Times
SCHIEDERWERK Showcases Novel Power Supply Solutions for Mission-Critical Applications at electronica 2026
Semiconductor Digest
Micron Plans to Invest Up to $50 Million to Support Genesis Mission Graduate Fellowship and National Laboratory Research
DIGITIMES
Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
Semiconductor Digest
GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components
DIGITIMES
Interview: How AI forecasting and energy scheduling are raising the bar for green power sellers
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