DIGITIMES

Samsung steps up HBM cooling as TSMC expands CoWoS

Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management challenges.

By DIGITIMES

1 min read
Samsung steps up HBM cooling as TSMC expands CoWoS
Samsung steps up HBM cooling as TSMC expands CoWoS

Got news to share with the events industry?

Submit a press release or story tip and reach thousands of event professionals.

Get in touch→

More in Semiconductors & Microelectronics

Related Insights