Semiconductor Engineering

Chip Industry Technical Paper Roundup: Oct. 6

Low-contact-resistance WSe₂ transistors; backside clock meshes for 2nm GAAFETs; row-parallel processing in DRAM; HBF for high-throughput LLM serving; formal security analysis of CAN XL; abstraction and validation from physical devices to RTL. The post Chip Industry Technical Paper Roundup: Oct. 6 appeared first on Semiconductor Engineering.

By Semiconductor Engineering

1 min read
Chip Industry Technical Paper Roundup: Oct. 6
AI-generated illustration

Got news to share with the events industry?

Submit a press release or story tip and reach thousands of event professionals.

Get in touch→

More in Semiconductors & Microelectronics

Related Insights