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Semiconductor Digest
Applied Materials, Intel Deepen R&D Collaboration on Transistor Scaling and Advanced Packaging
DIGITIMES
Robotaxis intensify charging infrastructure pressure, could drive over 35% of North American EV power demand by 2030
DIGITIMES
iRobot races to catch Chinese robot vacuum rivals after admitting innovation lag
Semiconductor Engineering
Monolithic 3D Memristor-TFT Stack For Programmable Neuromorphic Computing (SNU, Yonsei)
DIGITIMES
Chip price hikes loom as Taiwan IC designers brace to pass on costs through 2027
EE Times
The AI Boom Has a Gigawatt Accounting Problem
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