Semiconductor Digest

Qnity Develops 330°C Sealing Material for High-Temperature Chipmaking Processes

New Kalrez 7080 sealing solution strengthens an integrated portfolio of technologies designed to improve yield, reliability, and tool performance. The post Qnity Develops 330°C Sealing Material for High-Temperature Chipmaking Processes appeared first on Semiconductor Digest.

By Semiconductor Digest

1 min read
Qnity Develops 330°C Sealing Material for High-Temperature Chipmaking Processes
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