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DIGITIMES
Innodisk, Apacer post September 2026 revenue growth on AI demand
DIGITIMES
Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
EE Times
Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI
EE Times
Scaling 3D IC design: Trends, Challenges and Practical Workflows
Semiconductor Digest
Wristwatch-Type Wearable Sensor Enables Real-Time Monitoring of Sodium and Potassium
EE Times
Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems
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