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Semiconductor Engineering
Carbon-Dot Interface Enables Ultrathin High-κ Dielectrics on 2D Semiconductors (UIUC, NETL, Argonne, Monash)
Semiconductor Digest
ERS Introduces Automated 310mm Panel-Level Packaging System
Semiconductor Digest
Applied Materials Unveils $5B EPIC Center in Silicon Valley
DIGITIMES
Foxconn's Vietnam unit Fukang Technology more than doubles registered capital to US$710.4 million
DIGITIMES
Taiwan optical suppliers post record sales as Lumentum warns of shortages
Semiconductor Digest
Microchip Expands AI Data Center Portfolio with PCIe 6.0 Switch and Storage Upgrades
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