DIGITIMES

Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030

China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate the adoption of locally developed wafer fabrication tools, reinforcing China's chipmaking self-sufficiency efforts. The partnerships coincide with Hua Hong's ambitious 2030 market-share targets for specialty processes, including embedded flash memory, power management, and image sensors.

By DIGITIMES

1 min read
Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030
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