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  3. Huawei’s new Kirin chip puts LogicFolding to the test, with bigger ambitions in AI

South China Morning Post

Huawei’s new Kirin chip puts LogicFolding to the test, with bigger ambitions in AI

Huawei Technologies’ latest flagship mobile processor is serving as a high-stakes test of whether the company can bypass US technology sanctions by layering circuits on top of each other to boost performance, according to analysts. The Shenzhen-based firm on Monday launched the Kirin 9050 Pro, the first commercial chip employing its LogicFolding architecture. The new strategy aims to squeeze greater computing power out of semiconductor designs without relying solely on the circuit-shrinking...

Continue with the complete report on the publisher’s website.

Read full article at South China Morning Post
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By South China Morning Post

8 September 2026|1 min read
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Technology & Digital Transformation
Huawei’s new Kirin chip puts LogicFolding to the test, with bigger ambitions in AI
Huawei’s new Kirin chip puts LogicFolding to the test, with bigger ambitions in AI
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