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Power grids can't keep pace with AI data center boom in EU, US
DIGITIMES
Interview: Advanced packaging shifts toward system-level co-design for AI
DIGITIMES
OpenAI, Microsoft filings intensify copyright fight over AI training
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Foxconn joins Quantron, Hongjing Drive in zero-emission commercial vehicle partnership
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MediaTek, Vivo bring 30B MoE models on-device in next AI phone race
Semiconductor Engineering
AI in Chip Design: From Code Generation to EDA Orchestration (University of Edinburgh)
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