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DIGITIMES
SK Hynix weighs US memory options as buyers lock in 2027 supply
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Samsung expands SRAM, IP to speed chip development
DIGITIMES
20 of China's OSATs push into advanced packaging amid EUV curbs
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Taiwan readies ETS pilot as overseas expansion drives demand
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Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects
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Taiwan to pilot ETS by end-2026, experts urge three safeguards
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