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Semiconductor Digest
GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components
DIGITIMES
WinWay tops NT$10 billion in revenue as AI demand lifts third-quarter results
Semiconductor Digest
Astera Labs Unveils PCIe 7 Connectivity Chips for Next-Generation AI Systems
EE Times
Rising Costs, Compute Demand Push ADAS Toward Modular AI
DIGITIMES
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
DIGITIMES
MediaTek 3Q26 revenue beats forecast, maintains peak-season momentum
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