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Semiconductor Digest
VON ARDENNE Scales HiPIMS Sputtering from Wafers to Panels

DIGITIMES
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead

Semiconductor Digest
HEIDENHAIN Brings Front-End Motion Control Precision to Advanced Packaging

Semiconductor Digest
Nordson SonoFlex Wins 2026 Best of West Award at SEMICON West

DIGITIMES
LCD TV panel prices struggle to rise in 4Q26

DIGITIMES
Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China
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