Semiconductor Engineering

Chip Industry Technical Paper Roundup: Oct. 13

M3D mem-TFT neuromorphic computing; 2D semiconductor nucleation; ultrathin high-κ dielectrics; hyper-NA EUV litho; bit-flip attack detection in AI accelerators; programmable DRAM controllers; foundry-compatible photonic bends. The post Chip Industry Technical Paper Roundup: Oct. 13 appeared first on Semiconductor Engineering.

By Semiconductor Engineering

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Chip Industry Technical Paper Roundup: Oct. 13
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