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EE Times
Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI
DIGITIMES
Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
EE Times
Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems
DIGITIMES
Ample revenue slips in September as passive component demand stays strong
DIGITIMES
Innodisk, Apacer post September 2026 revenue growth on AI demand
EE Times
Scaling 3D IC design: Trends, Challenges and Practical Workflows
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