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  3. Interview: Advanced packaging shifts toward system-level co-design for AI

DIGITIMES

Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.

Continue with the complete report on the publisher’s website.

Read full article at DIGITIMES
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By DIGITIMES

19 September 2026|1 min read
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Semiconductors & Microelectronics
Interview: Advanced packaging shifts toward system-level co-design for AI
Interview: Advanced packaging shifts toward system-level co-design for AI
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