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DIGITIMES
Taiwan's GIS targets 800G/1.6T AI optics, with laser packaging ramp-up starting 4Q26
Semiconductor Digest
Mixx Technologies Backs Open Standards for Near-Package Optical Connectivity
Semiconductor Digest
EV Group Advances Qubit Scaling Through Semiconductor Packaging Technology
DIGITIMES
AI server demand squeezes India's PCB supply as material costs surge
DIGITIMES
Tesla plans Cybertruck exit after Model S and Model X; raises stakes for Cybercab and Optimus
EE Times
GigaDevice New-Gen High-Performance MCU Portfolio for Full-Scenario Industrial Applications
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