Quantum Computing Report

Quobly and CEA-Leti Strengthen Collaboration via FAMES Pilot Line to Scale 300 mm Silicon Spin-Qubit Platform

Quobly and CEA-Leti are strengthening their collaboration through the FAMES Pilot Line, providing Quobly access to advanced processing tools for prototyping 3D integration and RF control layers for next-generation quantum processing units (QPUs). This partnership, alongside STMicroelectronics, aims to scale Quobly's QSOI® architecture, which integrates silicon spin qubits directly onto a 300 mm FD-SOI CMOS substrate. Quobly plans to offer initial cloud availability for its Alloy Pioneer processo

By Quantum Computing Report

1 min read
Quobly and CEA-Leti Strengthen Collaboration via FAMES Pilot Line to Scale 300 mm Silicon Spin-Qubit Platform
Quobly and CEA-Leti Strengthen Collaboration via FAMES Pilot Line to Scale 300 mm Silicon Spin-Qubit Platform

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